Key Responsibilities
- Lead end-to-end module-level competitor analysis, including mechanical, electrical, and architectural comparisons across industry competitors.
- Perform teardown and reverse engineering of competitor DIMMs (UDIMM, RDIMM, SODIMM, MRDIMM, etc.) focusing on:
- PCB layout, routing, stack-up, materials, and shielding
- Identification and analysis of non-DRAM components on the board (PMIC, Voltage Regulator, RCD, SPD, Data Buffer)
- Analyze signal integrity (SI), power integrity (PI), and thermal design choices and compare against internal designs and JEDEC Raw Card designs.
- Benchmark performance, margins, reliability, and design tradeoffs across speed grades and use cases.
- Collaborate closely with Design Engineering, Validation, Product Engineering to:
- Influence design choices and risk mitigation based on lessons learned from competitor analyses
- Support related customer discussions and assessment of competitive positioning
- Develop clear technical reports and executive-ready summaries highlighting insights, risks, trends and opportunities.
- Build and maintain a competitive intelligence repository and database to track evolutions in design, BOM, and other key product aspects.
- Mentor junior engineers and contribute to strengthening competitor analysis methodology and best practices.
Required Qualifications
- Bachelor’s or Master’s degree in Electrical/Electronics Engineering, Computer Engineering, or related field.
- 8+ years of experience in DRAM module design, validation, or system-level hardware engineering.
- Strong understanding of:
- DRAM module design, architecture, manufacturing and JEDEC standards
- High-speed signaling fundamentals (DDR4/DDR5)
- PMICs, Voltage Regulators, RCDs, SPDs, and module sideband interfaces
- Hands‑on experience with hardware teardowns, schematics, layout reviews, or lab-based analysis.
- Ability to independently drive technical investigations from problem statement to conclusion.
- Strong written and verbal communication skills, with experience presenting to senior technical and leadership audiences.
Preferred Qualifications
- Engineering experience with DRAM modules or other PCB level products.
- Prior exposure to competitive benchmarking or industry intelligence roles.
- Familiarity with product teardowns, oscilloscope‑based measurements, SI/PI tools, or ATE/UHS environments.
- Experience influencing design decisions across global, cross‑site teams.
Impact of Role
- Direct influence on design quality, cost competitiveness, and time‑to‑market.
- Early identification of competitive gaps and differentiation opportunities.
- Increased confidence in customer and executive discussions through data‑driven competitive insights.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com.