SR MGR R&D/PRODUCT DVL ENGINEERING

TE Connectivity Ltd.; Bengaluru; In loco; INR 3.500.000 - 6.500.000; Tempo pieno

Vantaggi offerti da questo lavoro

Competitive salary package

Performance-based bonus

Health and wellness incentives

Employee stock purchase program

Descrizione del lavoro

TE Connectivity Ltd. seeks a Sr. Manager for high-speed PCB design and simulation to drive strategy, execution and continuous improvement across AI and data center applications.

You will guide teams in design, verification and optimization, ensuring manufacturability and reliability while aligning with cross-functional goals. You will mentor engineers, define roadmaps, manage projects, and stay updated with IPC standards and advanced simulation tools to maintain a competitive edge in fast-paced

Competenze

• Bachelor's degree in electrical or electronics engineering.
• Masters degree in a related field preferred.
• 20 years of extensive hands-on experience in high-speed PCB design and simulation.

Mansioni

• Lead and mentor high-speed PCB design and simulation teams.
• Define roadmaps and best practices for signal integrity, PI, EMC, RFI and thermal analysis.
• Collaborate with hardware, firmware, mechanical, and manufacturing teams to translate requirements into designs.
• Oversee multiple complex PCB projects ensuring deadlines, budget and performance targets.
• Provide technical guidance on layout, schematic creation and component selection.

Conoscenze

High-speed PCB design

Signal integrity

Power integrity

EMC/RFI/thermal analysis

PCB layout/schematic

Routing/DFM

Altium Designer

Allegro

PADS

SIwave/HFSS

PathWave ADS

Sigrity/Cadence

HyperLyX/CST/Celsius

IPC/JEDEC/PCIe/USB/Ethernet

Formazione

Bachelor's degree in electrical or electronics engineering

Masters degree in related field (preferred)

Strumenti

Altium Designer

Allegro

PADS

Descrizione del lavoro

Job Description

Job Overview

Digital Data Networks (DDN) Business Unit in TE Connectivity, where we enable high-speed connectivity solutions that power todays and tomorrows data-driven world. Engineering team is responsible for development of innovative interconnect solution products which are used in hyperscale computers, AI, Datacenter, Cloud server, and other IT systems, including connector, cable assembly, bus bars and sockets. We engineer and manufacture cutting-edge interconnect solutions that support high-speed data transmission, signal integrity, and power efficiency.

Role Objective

Sr. Manager is a senior engineering leader for high-speed PCB Design and Simulations. They lead teams in designing, simulating, and validating high-performance high speed printed circuit boards for AI and Datacentre applications ensuring quality, performance, and manufacturability through strategic planning, technical guidance, and collaboration across cross-functional teams.Responsibilities include team development,design and simulation strategy,project management, and continuous process improvement to meet deadlines, budget targets, and project performance goals.

Responsibilities

• Team Leadership Development:Lead, mentor, and develop teams of high-speed PCB design and simulation managers and engineers, focusing on their career growth and skill development.
• Strategic Design and Simulation:Define and implement high speed design and simulation roadmaps, methodologies and best practices for signal integrity, power integrity,electromagnetic compatibility(EMC), radio frequency interference (RFI) and thermal analysis.
• Cross-Functional Collaboration:Work closely with hardware, firmware, mechanical, and manufacturing teams to translate requirements into viable designs and resolve issues.
• Project Resource Management:Oversee the management of multiple complex PCB design and simulation projects, ensuring they meet deadlines, budget requirements, and performance targets.
• Technical Oversight:Provide technical guidance on PCB layout, schematic creation, and component selection, staying current with new technologies and design standards.
• Design review and verifications: Conduct design and simulation reviews, providing strategic recommendations to optimize PCB performance and reliability.
• Continuous improvement: Drive innovation and improvement in high-speed PCB design and simulation process. Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge.
• Quality and Validation: lead and drive accuracy in design and simulations, conduct design of experiments (DoE), plausibility check and sensitivity study of simulations, validate simulation results with experimental data, and design optimizations for first time right manufacturability (prototypes and mass production).

Candidate Desired Profile

Education

A bachelors degree in electrical or electronics engineering from a premier institute/university. A masters degree in a related field is preferred.

Experience

20 yrs extensive hands-on experience in high-speed PCB design and simulation with a proven track record of delivering complex projects.

Leadership

8-10 years progressive leadership or management experience in leading and developing high-performing engineering teams. Experience in customer engagement and stakeholder management is essential.

Technical Skills

• Deep understanding of engineering principles for high-speed PCB design, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
• Deep understanding of PCB layout, schematic creation, routing, and manufacturability.
• Expertise in high-speed PCB design tools such as Altium Designer, Allegro or PADS.
• Expertise in high-speed PCB simulation tools for electrical and thermal analysis - Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
• Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).

Soft Skills

• Proven abilities on inspiring leadership, team management, prioritisation, strategy and execution.
• Experience in organizational development, and talent attraction/management/retention.
• Promote and manage employee wellbeing and work-life balance.
• Passion for Technology and scientific/engineering excellence.
• Excellent problem-solving and analytical skills to resolve complex technical issues.
• Strong in Technical Documentations, Report preparation and presentation
• Strong verbal and written communication skills to articulate complex technical concepts to both technical and non-technical stakeholders.
• Ability to work effectively in a fast-paced, collaborative global environment and global time zones.
• Proficient using MS office software (Word, Excel, PPT, Outlook, MS Teams, etc.).

What your background should look like

Generally requires Bachelors degree in appropriate field with 12 or more years of experience; or Masters with 10 or more years of experience; or PhD level with 6 or more years of experience; or local equivalent

SET : Strategy, Execution, Talent (for managers)

TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future.

Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at and on , , and

What TE Connectivity Offers

We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority!

Competitive Salary PackagePerformance-Based Bonus PlansHealth and Wellness IncentivesEmployee Stock Purchase ProgramCommunity Outreach Programs / Charity Events

IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD

TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com. If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities.

Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site.