Sr. Manager, Test Engineering

Paycom - ATS; Pune District; On-site; INR 2,500,000 - 4,500,000; Full time

Job summary

Paycom - ATS in Pune is seeking a senior test engineering leader to drive the development, validation, and release of test solutions for SiC and GaN devices. You will guide the team, coordinate with OSATs and external partners, and drive improvements in yield, throughput, and test coverage.

The role requires 8–10 years in semiconductor test and strong leadership, with hands-on expertise in ATE, wafer probing, and test hardware. Collaboration with product engineering and supply chain is essential.

Qualifications

• Bachelor's or Master's in Electrical/Electronics Engineering required.
• 8–10 years in semiconductor test and product engineering, with leadership experience.
• Experience releasing production test solutions using automated test systems.
• Strong understanding of device behavior, yield analysis and manufacturing controls.
• Experience with OSATs, external test houses, or test hardware suppliers.

Responsibilities

• Lead Pune test engineering team and prioritize deliverables.
• Develop and release wafer sort, final test, characterization, and module test solutions for SiC/GaN products.
• Qualify and validate ATE, probers, handlers, and test hardware for production use.
• Drive test program correlation and transfer between testers and external locations.
• Analyze test data to identify yield loss, false failures, and cycle-time improvements.
• Mentor engineers and promote problem solving, rigorous execution, and continuous improvement.

Skills

Semiconductor test methods

High-voltage measurements

ATE systems

Wafer probing

Root cause analysis

Data analytics

Cross-functional leadership

Education

Bachelor's or Master’s in Electrical/Electronics Engineering

Tools

Probe cards

Load boards

Test fixtures

OSAT coordination

Test hardware

Job description

Key Responsibilities and DutiesLead and develop the Pune test engineering team, assign priorities, and ensure timely completion of engineering deliverables.Develop, validate, qualify, and release wafer sort, final test, characterization, and module test solutions for SiC and GaN products.Create and maintain test plans, test programs, specifications, limits, guard bands, validation reports, and controlled release documentation.Support DC, AC, dynamic, parametric, high-voltage, high-current, and application-relevant testing for power semiconductor devices.Coordinate test hardware development, including probe cards, load boards, sockets, fixtures, interface hardware, and handlers.Qualify ATE, probers, handlers, and test hardware for engineering and production use.Drive test program correlation and transfer between internal testers, OSATs, and external test locations.Analyze test and manufacturing data to identify yield loss, false failures, test escapes, equipment issues, and cycle-time improvement opportunities.Lead root-cause analysis and corrective actions for test-related yield, quality, reliability, and manufacturing issues.Improve test coverage, repeatability, throughput, uptime, multisite efficiency, and cost of test.Automate test execution, data collection, reporting, equipment monitoring, and engineering analysis where practical.Support new product introduction, qualification, Safe Launch, production ramp, and ongoing manufacturing requirements.Work with Product Engineering, Design, Package Engineering, Quality, Reliability, Operations, and Supply Chain to resolve technical issues and meet program schedules.Manage technical execution with OSATs, test houses, ATE vendors, handler suppliers, socket vendors, and test hardware partners.Support supplier reviews, equipment capability assessments, capacity planning, maintenance controls, and manufacturing risk mitigation.Ensure compliance with electrical safety, high-voltage laboratory, quality, calibration, traceability, and document-control requirements.Mentor engineers and promote disciplined problem solving, technical rigor, accountability, and continuous improvement.Knowledge, Skills, Abilities, and Other Characteristics (KSAOs)Strong knowledge of semiconductor test methods and high-voltage electrical measurements.Hands-on understanding of ATE, test programs, wafer probing, final test, handlers, and test hardware.Strong analytical, statistical, troubleshooting, and structured problem-solving skills.Ability to manage multiple technical projects, manufacturing issues, and external suppliers.Effective written and verbal communication across global and cross-functional teams.Practical, hands-on leadership with strong execution and follow-through.Required QualificationsBachelor's or Master’s degree in Electrical Engineering, Electronics Engineering.8-10 years of semiconductor test, product engineering experience, including team or project leadership.Experience developing and releasing production test solutions using automated test systemsExperience with wafer-level test, final test, characterization, correlation, & high-volume semiconductor manufacturing.Strong understanding of device behavior, test coverage, measurement integrity, yield analysis, and manufacturing controls.Experience leading cross-functional engineering activities and mentoring engineers.Experience working with OSATs, external test houses, equipment vendors, or test hardware suppliers.Preferred QualificationsExperience testing SiC and/or GaN power semiconductor products.Experience with high-voltage, high-current, dynamic, switching, thermal, reliability, or power module testing.Knowledge of design for testability, guard banding, outlier detection, statistical process control, and test limit optimization.Experience with test data analytics, automated reporting, databases, or scripting.Experience transferring test solutions across engineering and manufacturing locations.