Senior Packaging Engineer

Sandisk; Bengaluru; On-site; INR 1,200,000 - 1,800,000; Full time

Job summary

Sandisk is seeking a hands-on Packaging Engineer to support SSD package development from concept through qualification and high-volume manufacturing ramp in Bengaluru. You will work with design, reliability, processes, OSAT, and supplier teams to ensure manufacturability and readiness.

Qualifications include a Master’s degree (Materials Science or related) and 3–5 years of experience with strong SMT/PCB packaging knowledge, DOE expertise, and data-driven problem solving.

Qualifications

• Master’s degree or higher in Materials Science, Manufacturing, Mechanical Engineering, Packaging Engineering, or related engineering disciplines.
• 3-5 years of relevant experience with a master’s degree, or 0-3 years with a PhD.
• Strong understanding of SMT, PCBA, PCB layout, solder joint reliability, board-level reliability, packaging materials, and failure analysis.
• Experience with DOE, statistical analysis, structured problem solving, and tools such as Minitab, JMP, or equivalent.
• Ability to work effectively in a fast-paced, cross-functional, global environment with strong communication and execution skills.

Responsibilities

• Support SSD package development from concept, design validation, qualification, and high-volume manufacturing ramp.
• Review package design drawings and provide feasibility feedback, DFX input, and improvement recommendations.
• Collaborate with global engineering, reliability, process, operations, OSAT, and supplier teams to ensure design implementation and manufacturing readiness.
• Support engineering builds, characterization, package qualification plans, and risk mitigation activities.
• Monitor assembly and test yield, support failure analysis, and drive corrective and preventive actions.
• Contribute to assembly process flows, work instructions, FMEA/PFMEA, control plans, process recipes, and SPC monitoring.
• Support the introduction of new packaging technologies, materials, and processes into production.

Skills

Packaging Eng.

Materials Science

Statistical Analysis

DOE

Minitab/JMP

Education

Master's degree in Materials Science or related

Tools

Minitab

JMP

Job description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Description

We are looking for a hands-on Packaging Engineer to support SSD package development from concept through qualification and high-volume manufacturing. This role will work closely with global design, reliability, process, operations, OSAT, and supplier teams to deliver innovative, manufacturable, and reliable packaging solutions.

• Support SSD package development from concept, design validation, qualification, and high-volume manufacturing ramp.
• Review package design drawings and provide feasibility feedback, DFX input, and improvement recommendations.
• Collaborate with global engineering, reliability, process, operations, OSAT, and supplier teams to ensure design implementation and manufacturing readiness.
• Support engineering builds, characterization, package qualification plans, and risk mitigation activities.
• Monitor assembly and test yield, support failure analysis, and drive corrective and preventive actions.
• Contribute to assembly process flows, work instructions, FMEA/PFMEA, control plans, process recipes, and SPC monitoring.
• Support the introduction of new packaging technologies, materials, and processes into production.

Qualifications

Required

Qualifications

• Master’s degree or higher in Materials Science, Manufacturing, Mechanical Engineering, Packaging Engineering, or related engineering disciplines.
• 3-5 years of relevant experience with a master’s degree, or 0-3 years with a PhD.
• Strong understanding of SMT, PCBA, PCB layout, solder joint reliability, board-level reliability, packaging materials, and failure analysis.
• Experience with DOE, statistical analysis, structured problem solving, and tools such as Minitab, JMP, or equivalent.
• Ability to work effectively in a fast-paced, cross-functional, global environment with strong communication and execution skills.

Preferred

Qualifications

• Excellent written and communication skills, enabling collaboration with global functional teams
• Knowledge of thermo-mechanical aspects of semiconductor packages
• Knowledge in data analytics or AI/ML techniques is a plus.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [e-mail] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.