Mechanical Engineering Technical Leader Exp - 12 Years

Cisco; Bengaluru Urban; On-site; INR 1,800,000 - 2,400,000; Full time

Job summary

Cisco Bengaluru is seeking a senior mechanical engineer to drive electro-mechanical packaging design for telecom hardware. You will work on 1RU to 40RU chassis, complex PCB assemblies, and high-performance cooling solutions within the CHG framework.

Join a collaborative team focused on innovation, reliability, and scalable hardware. The role emphasizes cutting-edge design, customer impact, and adherence to IEEE/industry standards.

Qualifications

• 12+ years hands-on mechanical design with BTech/MTech in Mechanical Engineering.
• 8+ years with PhD.
• Experience designing electro-mechanical packaging for telecom gear using CREO & UG-NX.
• Chassis concept/architecture and PCB size/orientation optimization.
• Customer-facing experience and failure analysis knowledge.
• Gen AI in design to automate processes is a must.
• Produce detailed MCAD layouts and fabrication drawings.

Responsibilities

• The job involves working on current and next generation mechanical designs of telecom systems.
• We are looking for you, who will strive in a dynamic environment.
• You will be part of a dedicated team having open communications, empowerment, innovation, teamwork and customer success as team foundations.
• The mechanical & thermal team is an integrated part of HW organization, responsible for varieties of complex electro-mechanical designs, which include but are not limited to central office networking products (1RU to 40RU), outdoor mobility equipment, high performance thermal solutions and complex PCB assemblies.
• We are looking for an outstanding mechanical engineer to help in development activities, passionate about electro-mechanical packaging design and thermal/flow sciences, and eager to work on next-generation solutions.

Skills

Mechanical design

Electro-mechanical packaging

AI-assisted design

Team collaboration

Education

BTech/MTech in Mechanical Engineering

PhD (optional)

Tools

CREO

UG-NX

Job description

Job Description:

Meet the Team

Cisco Hardware Engineers develop and work with Next Generation Technology to build Cisco Hardware products keeping in mind the user experience and in accordance with IEEE standards, and industry best practices.

Join our high-impact Systems & Optics (SaO) team within Cisco’s Common Hardware Group (CHG), providing essential support across key verticals including SP Routing, Enterprise Routing, and Switching. Our team is a foundational partner across CHG—driving innovation, advancing design reliability, and enabling scalable hardware solutions that power Cisco’s most critical products.

Your Impact

• The job involves working on current and next generation mechanical designs of telecom systems.

• We are looking for you, who will strive in a dynamic environment.

• You will be part of a dedicated team having open communications, empowerment, innovation, teamwork and customer success as team foundations.

• The mechanical & thermal team is an integrated part of HW organization, responsible for varieties of complex electro-mechanical designs, which include but are not limited to central office networking products (product ranges from 1RU to 40RU sizes), outdoor mobility equipment, high performance thermal solutions and complex PCB assemblies.

• We are looking for an outstanding mechanical engineer to help in the development activities, who is passionate about electro-mechanical packaging design and thermal/flow sciences and like to work on next-generation creative solutions to deliver best-in-class networking products.

Minimum Qualifications

• 12+ years of hands-on design experience with BTech/MTech in Mechanical Engineering or 8+ years with PhD.

• Hands on mechanical design experience in electro-mechanical packaging of standalone and rack mount chassis/ systems used in telecom industries using CREO & UG-NX.

• Chassis concept/architecture, establishing optimized printed circuit board (PCB) size(s) and outline, developing sheet-metal enclosures to meet intended performance and cost targets, power shelf and power distribution design.

• Should have proven track record of working with Customer-facing teams in supporting new product/ platform initiation discussions and deep knowledge of Failure Analysis processes.

• Drive innovation and new technology adoption along with AI aided design processes. Experience in creating Gen AI modules to simplify and automate design processes is a must have.

• Perform detailed MCAD product layout studies to ensure project objectives are met and work with team to release detail fabrication drawings (sheet-metal, plastic, cable, labels, etc.) and assembly drawings required for project prototype release.

Preferred Qualifications

• Special emphasis on product design for low cost (high volume) and ease of manufacture is required.

• Good command of tool based tolerance analysis, structural analysis and DFM/DFA concepts.

• Thermal simulation & validation experience would be an added advantage.

Why Cisco?

At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.

We are Cisco, and our power starts with you.