Mechanical Design Engineer

Skynetics; Bengaluru; On-site; INR 900,000 - 1,300,000; Full time

Job summary

Skynetics in Bengaluru, India, is seeking a Mechanical Design Engineer to develop advanced mechanical structures, RF hardware, and rugged enclosures for aerospace and defence applications.

You will lead end-to-end mechanical design and analysis of RF modules, SDR platforms, and high-power assemblies, collaborating with RF, electronics, and embedded teams to ensure lightweight, thermally efficient, and robust hardware capable of operating in demanding environments.

Qualifications

• Degree in Mechanical Engineering or related discipline.
• Strong understanding of mechanical design fundamentals, materials, and manufacturing processes.
• Proficiency in CAD tools such as SolidWorks, CATIA, or equivalent.
• Experience in precision mechanical design for RF systems.
• Knowledge of thermal management and RF shielding.
• Familiarity with FEA and structural simulation.
• Understanding of RF hardware packaging and EMI/EMC considerations.
• GD&T experience.

Responsibilities

• Design precision mechanical components, enclosures, and ruggedized housings for aerospace and RF systems.
• Develop mechanical packaging for RF transceivers, PA, and SDR platforms.
• Collaborate with RF and electronics teams to optimize EMI/EMC and grounding.
• Perform thermal modelling and thermal management design.
• Conduct FEA to assess stress, vibration, and structural integrity.
• Create 3D CAD models, 2D drawings, GD&T specs, and fabrication docs.

Skills

Mechanical design

RF hardware integration

Thermal management

FEM/FEA

CAD - SolidWorks/CATIA

GD&T

Fabrication knowledge

Engineering analysis

Education

Bachelor's degree in Mechanical Engineering

Tools

SolidWorks

CATIA

ANSYS Mechanical

SolidWorks Simulation

AutoCAD / Fusion 360

Job description

Job Description

Skynetics is seeking a skilled and passionate Mechanical Design Engineer to join our R&D team in developing advanced mechanical structures, RF hardware, thermal management solutions, and ruggedized enclosures for aerospace and defence applications.

The role involves end-to-end mechanical design and analysis of high-performance electronic and RF systems, including RF modules, Software-Defined Radios (SDRs), electronic warfare (EW) systems, communication equipment, and airborne or space-bound payloads. The candidate will work closely with RF, electronics, PCB, and embedded systems engineers to deliver compact, lightweight, thermally efficient, and mechanically robust hardware capable of operating in demanding environments.

Key Responsibilities

1. Mechanical Design & RF Hardware Integration

• Design and develop precision mechanical components, assemblies, chassis, and ruggedized enclosures for aerospace, defence, and RF electronic systems.
• Develop mechanical packaging for RF transceivers, RF front-end modules, power amplifiers (PAs), and SDR platforms.
• Design RF housings, shielded compartments, partition walls, waveguide interfaces, coaxial connector mounts, and RF module mounting arrangements.
• Collaborate with RF engineers to optimize mechanical structures for RF shielding, electromagnetic interference (EMI), electromagnetic compatibility (EMC), grounding, and isolation between RF sections.
• Consider RF-sensitive mechanical design parameters, including enclosure cavity effects, connector transitions, shielding continuity, conductive contact surfaces, and thermal expansion near RF components.
• Design compact, lightweight, and space-efficient mechanical assemblies while maintaining structural integrity, serviceability, and manufacturability.
• Generate detailed 3D CAD models, 2D manufacturing drawings, assembly drawings, GD&T specifications, and fabrication documentation.

2. Thermal Analysis & Thermal Management

• Perform thermal analysis and thermal modelling of RF and electronic assemblies, including high-power RF amplifiers, power supplies, FPGA-based systems, RFSoCs, and other heat-generating components.
• Develop effective thermal management solutions using heat sinks, thermal spreaders, conduction plates, thermal interface materials (TIMs), chassis cooling, and forced-air cooling where applicable.
• Evaluate heat dissipation through component packages, PCB interfaces, mechanical housings, and equipment mounting structures.
• Perform steady-state and transient thermal analysis to estimate component temperatures, thermal gradients, and system-level thermal performance.
• Calculate thermal resistance, heat flow, power dissipation, and temperature rise under different operating conditions.
• Optimize enclosure geometry, material selection, wall thickness, contact interfaces, and cooling arrangements to improve heat transfer and reduce hot spots.
• Work with PCB and electronics teams to assess component placement, thermal coupling, and heat transfer between electronic boards and mechanical structures.
• Evaluate thermal expansion, differential expansion between dissimilar materials, and thermal stresses under operating and environmental temperature extremes.
• Support thermal validation through laboratory measurements, temperature mapping, and correlation of simulation results with experimental data.

3. Finite Element Analysis (FEA) & Structural Simulation

• Conduct Finite Element Analysis (FEA) to evaluate the structural integrity and mechanical performance of components, enclosures, chassis, mounting brackets, and payload structures.
• Perform static structural analysis to assess stress distribution, strain, deformation, stiffness, and structural margins under specified loading conditions.
• Conduct modal analysis to determine natural frequencies and mode shapes, helping identify potential resonance issues in airborne, vehicle-mounted, and other vibration-sensitive systems.
• Perform vibration and mechanical shock analysis to assess the robustness of mechanical assemblies during transportation, launch, handling, and operational use.
• Evaluate thermal stress, thermal deformation, and coupled thermal-structural effects caused by temperature variations and component heating.
• Assess fasteners, mounting interfaces, structural joints, and PCB mounting arrangements for mechanical reliability.
• Support random vibration, sine vibration, shock response, and other dynamic analyses as required by project specifications and applicable qualification requirements.
• Establish appropriate boundary conditions, material properties, load cases, mesh settings, and acceptance criteria for simulation studies.
• Interpret simulation results and recommend design improvements to reduce stress concentrations, excessive deformation, resonance risks, and unnecessary weight.
• Correlate FEA predictions with physical testing wherever practical and maintain analysis reports for design verification and engineering reviews.

Required Skills & Qualifications

• Degree or diploma in Mechanical Engineering, Mechanical Design, Mechatronics, or a related discipline.
• Strong understanding of mechanical design fundamentals, engineering mechanics, material properties, and manufacturing processes.
• Proficiency in CAD tools such as SolidWorks, CATIA, or equivalent; working knowledge of AutoCAD or Fusion 360 is beneficial.
• Experience in precision mechanical design, 3D modelling, 2D manufacturing drawings, assemblies, and GD&T.
• Practical understanding of thermal management, heat transfer, conduction, convection, thermal resistance, and thermal expansion.
• Knowledge of FEA and structural simulation, including static structural, modal, vibration, shock, and thermal-stress analysis.
• Familiarity with simulation tools such as ANSYS Mechanical, ANSYS Icepak, SolidWorks Simulation, or equivalent.
• Understanding of RF hardware packaging, RF shielding, EMI/EMC considerations, conductive enclosures, grounding, and thermal requirements of high-power RF electronics.
• Knowledge of CNC machining, sheet-metal fabrication, material selection, surface treatments, and mechanical fastening.
• Strong analytical skills, attention to detail, and the ability to interpret engineering drawings and simulation results.