Lead Engineer-Thermal

QUALCOMM, Inc.; Hyderabad; On-site; INR 1,200,000 - 2,000,000; Full time

Job summary

Qualcomm India Private Limited in Hyderabad is seeking Power and Thermal Engineers to design, analyze, and optimize power delivery and thermal solutions for high-power CPU-based server-class SoCs. The role requires collaboration with silicon design, power architecture, package, platform, BIOS, firmware, and external cooling vendors to ensure reliable performance.

You will perform lab measurements, correlate simulations with test data, and support platform bring-up with power-thermal

Qualifications

• Bachelor's or Master's degree in Computer Science, Electronics, Electrical Engineering, or related field.
• 2+ years of programming experience in C, C++, Java, or Python.
• Strong understanding of software engineering fundamentals.

Responsibilities

• Power Features Enablement, Analysis and Optimizations for CPU performance and state management.
• Define and evaluate thermal solutions: limits management, heat sinks, vapor chambers, TIM selection and optimization, thermal and throttling state management.
• Collaborate with platform teams on server mechanical and airflow design.
• Support power-thermal co-optimization during silicon bring-up and correlate lab measurements with simulations.

Skills

C

C++

Java

Python

Education

Bachelor's or Master's degree in Computer Science, Electronics, Electrical Engineering, or related field

Job description

Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Software Engineering

General Summary:

Qualcomm PPAT Team is looking for Power and Thermal Engineers to design, analyze, and Optimize Power and provide Thermal solutions for high-power CPU based server-class SoCs. Candidate will work closely with silicon design, power architecture, package, platform, and system teams to ensure reliable power and performance across critical server environments.

Key Responsibilities:

• Power Features Enablement, Analysis and Optimizations
  • CPU performance and state management
  • CPU and System Idle state management
  • Power and Performance telemetry
• Define and evaluate thermal solutions:
  • Limits management
  • Heat sinks, vapor chambers, cold plates
  • TIM selection and optimization
  • Thermal and Throttling state management
• Collaborate with platform teams on server mechanical and airflow design.
• Support power-thermal co-optimization during silicon bring-up.

Validation & Correlation

• Define and execute power and thermal execution plans:
  • Lab measurements (power breakdown, thermocouples)
  • Power virus and workload-based testing
• Correlate simulation vs lab data and drive design improvements.

Cross-Functional Collaboration

• Partner with:
  • Silicon design & power teams
  • Platform, BIOS, and firmware teams
  • External ODM/OEM and cooling vendors
• Provide thermal guidance during platform bring-up and customer engagements.

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 3+ years of Software Engineering or related work experience.

OR

Master's degree in Engineering, Information Systems, Computer Science, or related field and 2+ years of Software Engineering or related work experience.

OR

PhD in Engineering, Information Systems, Computer Science, or related field and 1+ year of Software Engineering or related work experience.

• 2+ years of academic or work experience with Programming Language such as C, C++, Java, Python, etc.

Required Qualifications

Education

• Bachelor’s or Master’s degree in Computer Science, Electronics, Electrical Engineering, or related field.

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