Internship - Failure Analysis (FA) Lab

Infineon Technologies AG; Malacca; On-site; INR 167,000 - 279,000; Part time

Job summary

Infineon Technologies AG is offering an internship in the Failure Analysis (FA) Lab. The role involves performing basic FA on package level, starting from optical inspection to high power analysis, and preparing reports to enable root-cause and corrective actions.

You will support FA equipment maintenance and learn across semiconductor processes. The internship targets engineering students with 6+ months of experience and CGPA 3.0+.

Qualifications

• Bachelor's or Master's in Engineering with strong academic record.
• Internship of 6+ months preferred; CGPA 3.0+.
• Fundamental knowledge of FA sample prep, including wet/dry chemical processes and backside preparation.
• Familiarity with Optical Microscopy, SEM, EDX and FTIR for defect imaging and characterization.
• Understanding of semiconductor manufacturing, device physics, fabrication technologies, and testing methodologies.
• Strong analytical skills, attention to detail, and eagerness to learn.

Responsibilities

• Perform basic Failure Analysis (FA) on package level from optical inspection to high power analysis.
• Prepare FA reports to support root cause finding and corrective actions with cross functional teams.
• Assist with FA equipment/tool maintenance and basic upkeep.

Skills

Optical Microscopy

SEM

EDX

FTIR

Failure Analysis

Analytical Skills

Attention to Detail

Willingness to Learn

Education

Bachelor's degree in Engineering

Master's degree in Engineering

Tools

SEM

EDX

FTIR

Job description

Internship for Failure Analysis (FA) LabYour roleKey responsibilities in your new rolePerform basic Failure Analysis [FA] on package level starting from physical inspection via low and high power optical microscope.Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.Support FA equipment / tool maintenance.Your profileQualifications and skills to help you succeedBachelor's Degree or Master's Degree in Engineering.Preferably internship duration of 6 months and above.Minimum CGPA of 3.00 and above.Basic knowledge of failure analysis sample preparation, including wet/dry chemical processes, backside preparation, cross-sectioning, and package preparation.Familiarity with Optical Microscopy, SEM, EDX, and FTIR for defect imaging and characterization.Understanding of semiconductor manufacturing processes, device physics, fabrication technologies, and testing methodologies.Strong analytical skills, attention to detail, and willingness to learn.#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?We are on a journey to create the best Infineon for everyone.We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.Please let your recruiter know if you need any accommodations during the interview process.Learn more about our various contact channels and about Diversity & Inclusion at Infineon.Shanice [e-mail]