Turn this role into an interview — a resume and cover letter built around what this employer wants.
Kandou AI seeks a Firmware Engineer Lead based in Hyderabad/Bangalore to drive embedded firmware for high-speed Ethernet data-center products. You will design, implement, and optimize firmware for chiplet-based memory fabrics, collaborating across hardware and software teams to ensure robust HW-SW interfaces.
The role requires leadership experience in SoC firmware, plus strong C/C++ and Python skills, with a focus on scalable, energy-efficient AI infrastructure components.
https://www.thecube.net/events/nyse/ai-factory-data-center-of-the-future/content/Videos/d1ad8af3-1424-4336-a9b3-1d02b5a354b4
we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
our architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.