Director Engineering, Analog Design (Power ICs) - Chip Lead

Renesas Electronics Corporation; Bengaluru; On-site; INR 6,000,000 - 8,000,000; Full time

Benefits offered by this job

Competitive benefits

Job summary

Renesas Electronics Corporation in Bengaluru seeks a Director of Engineering with deep expertise in mixed-signal IC development. You will define optimum system architecture for application-specific ICs, spanning analog signal-chain products, high-power delivery, and digital-controller architectures, while mapping needs to Renesas IP and identifying new development requirements.

You will collaborate across business units, system engineering, packaging, back-end, design, test, and operations to

Qualifications

• 15+ years of experience in mixed-signal IC, analog IC, power IC, or related semiconductor product development.

Responsibilities

• Define optimum system architecture for application-specific ICs spanning analog signal-chain products, high-power delivery, mixed-signal integration, and digital-controller architectures.
• Collaborate across business units, system engineering, packaging, back-end, design, test, and operations teams to execute IC development with cost efficiency.
• Identify critical skill needs and build the right technical team from scratch.
• Lead development programs through concept definition, architecture, specification, planning, execution, verification, validation, qualification, and production handoff.

Skills

Leadership

System architecture

Mixed-signal IC

Cross-functional leadership

Automotive qualification

Team building

Communication skills

DFT knowledge

Education

Bachelor/Masters in Electronics Engineering

Tools

CMOS/IP reuse

Job description

Job Description

We are seeking a Director,Engineeringwith deepexpertisein mixed-signal IC development to support Renesas' India-focused growth initiatives. This role is technical, cross-functional, and product-defining.

The successful candidate will defineoptimumsystem architecture for application-specificICs, spanninganalogsignal-chain products, high-power delivery, mixed-signal integration, and digital-controller-based architectures. The role will map product needs to existing Renesas IP across business units andidentifywhere new development isrequired.

You will be expected to collaborate across business units, system engineering,analogpackaging, back-end, design, test, and operations teams to executeICdevelopment with an efficient cost structure. You will alsoidentifycritical skill-set requirements and build the right technical team from scratch.

Product & Architecture Leadership

• Work with product definition / IC architect team tooptimizesystem architecture for application-specificICsserving India market requirements across automotive, industrial, power, and mixed-signal applications.
• Understandcustomer use cases, system requirements, cost targets, and application constraintstooptimizearchitecture
• Cover a broad technical span, ranging fromanalogsignal-chain products to high-power delivery with digital controllers.
• Drive architecture trade-offs across performance, integration level, BOM cost, manufacturability, qualification effort, and reuse of existing Renesas technology.

Cross-Business Unit IP Reuse & Collaboration

• Map target architectures to available IP across different business units within Renesas andidentifygaps requiring new development.
• Collaborate with multiple business units, system engineering,analogpackaging, back-end, design, test, and operations teams to execute the development plan.
• Repurpose existing resources and IP wherever practical, while being clear where reuse creates unacceptable product, schedule, or execution risk.
• Create structured technical alignment across stakeholders who may have different priorities, schedules, and ownership models.

Development Execution

• Lead development programs through concept definition, architecture, specification, planning, execution, verification, validation, qualification, and production handoff.
• Build execution plans that include ownership, milestones, technical risks, resource needs, cost assumptions, and decision gates.
• Ensure development choices are grounded in realistic foundry, packaging, test, DFT, qualification, and manufacturing constraints.
• Collaborate with system engineering teams to defineICrequirements and ensure the product solves real application-level problems.

Automotive Quality, DFT & Reliability Planning

• Understand automotive qualification requirements for integrated circuits during design planning and translate them into execution needs.
• PlanrequiredDFT structures, test coverage, reliability flows, and production test implications early in the design phase.
• Understand system-level faultbehavior, protection needs, and safety-related requirements where relevant to automotive and industrial applications.
• Create a practical bridge between product ambition and qualification realities, including schedule, cost, and silicon iteration risk.

Team Building & Technical Leadership

• Identifycritical skill-set requirements and hire the right people for the development team.
• Build and mentor a high-quality technical team, including architecture, design, verification, validation, and execution contributors.
• Assess technical depth during hiring and avoid over-reliance on surface-level experience claims.
• Represent the program in senior leadership reviews with clear choices, trade-offs, risks, and asks.

Qualifications

• 15+ years of experience in mixed-signal IC,analogIC, power IC, or related semiconductor product development.
• Bachelor or Masters of Electronics Engineering related discipline from a reputed institution.
• Experience in leadingICdevelopment with multiple functional teams isa mustfor this role.
• Good understanding of history and future trends in semiconductor industry.
• Awareness of foundry capabilities for different CMOS, BCD and FET technologies will be an added advantage.
• Understanding of automotive qualification requirements for integrated circuits in the design phase and ability to plan execution with required DFT circuits.
• Good understanding of advanced semiconductor packaging technologies and their impact on cost, thermal performance, integration, and manufacturability.
• Previousexperience in building a team from scratch.
• Comfort and ability to collaborate and be effective in an entrepreneurial (fast-pacedand ambiguous) environment.
• Excellent interpersonal, communication and presentation skills and comfort in presenting to a wide range of audiences. Capable to communicate issues in a concise and effective way.
• Desire and drive to interact with, as well as ability to build andmaintainexcellent relationships with internal and external stakeholders.
• Product ownership mentality with strong affinity to technical depth.
• Self-driven, strongly motivated individual capable to take full ownership of their activities, and to involve other functions in the company or management when needed to bring them to a successful outcome.
• Should be motivated to handle unknowns of a beginner.

Company Description

Renesas is a global semiconductor leader shaping the backbone of next-generation automotive, industrial, cloud, and IoT innovation. With over$9.3 billionin annual revenue (2024) and a world-class team of 22,700+ employees, Renesas operates at scale whileretainingthe agility to drive category-defining breakthroughs. The company's footprint spans more than 30 countries, enabling deep customer proximity and a uniquely global innovative engine. As Japan's semiconductor powerhouse and a top global player in microcontrollers, analog, and power technologies, Renesas delivers real-world impact across EVs, smart factories, renewable energy infrastructure, and edge intelligence. For ambitious problem-solvers who want to work on meaningful, systems-level challenges with huge industry leverage, Renesas offers the scale, stability, and strategic clarity of a market leader, paired with the transformative momentum of a company reinventing how the world computes, connects, and electrifies.

Renesas has a growing presence in India with HC approaching 1000+ and significant presence with active government and university collaboration as well as OSAT footprint (JV with CG India). With the growing importance of India as a market (growing semiconductor market and government goals / mandates of localization needs) and talent hub, our division's (India for India) mission is to grow India market. We aspire to create products (SoCs, software,powerand analog chips etc.) which serveneedsfor localmarket. Renesas is a leading electronics supplier globally, and this is a unique opportunity to directly influence the future products which will be offered to our customers in a new, fastgrowingand large Indian market with specific needs and applications.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.