Director Engineering, Analog Design (Power ICs) - Chip Lead

Renesas Electronics; Bengaluru; On-site; INR 4,000,000 - 6,500,000; Full time

Job summary

Renesas Electronics seeks a Director of Engineering to define optimum system architectures for application‑specific ICs, spanning analog, mixed‑signal and power devices in India. You will lead cross‑functional teams, map IP, and drive development programs from concept through production.

You will champion automotive qualification considerations, DFT planning, and robust architecture trade‑offs while partnering with multiple business units and design teams, delivering practical, cost‑effective

Qualifications

• 15+ years of experience in mixed‑signal IC, analog IC, power IC, or related semiconductor product development.
• Experience leading IC development with multiple functional teams.
• Awareness of automotive qualification requirements and related DFT planning.
• Strong capabilities in system architecture and cross‑unit collaboration.

Responsibilities

• Lead Product & Architecture planning for ASPICs spanning automotive, industrial, power and mixed‑signal domains.
• Collaborate across business units and engineering teams to map IP, identify gaps and plan development.
• Drive execution from concept to production, with milestones, risks and resource planning.
• Plan automotive qualification, DFT structures, reliability flows, and production test implications.
• Build and mentor a high‑caliber technical team and represent the program in senior reviews.

Skills

Mixed-signal IC

Analog IC

Power IC

Semiconductor product development

Lead cross-functional teams

System architecture

DFT concepts

Education

Bachelor or Master in Electronics Engineering

Job description

Job Description

We are seeking a Director, Engineering with deep expertise in mixed-signal IC development to support Renesas' India-focused growth initiatives. This role is technical, cross‑functional, and product‑defining.

The successful candidate will define optimum system architecture for application‑specific ICs, spanning analog signal‑chain products, high‑power delivery, mixed‑signal integration, and digital‑controller‑based architectures. The role will map product needs to existing Renesas IP across business units and identify where new development is required.

You will be expected to collaborate across business units, system engineering, analog packaging, back‑end, design, test, and operations teams to execute IC development with an efficient cost structure. You will also identify critical skill‑set requirements and build the right technical team from scratch.

Product & Architecture Leadership

• Work with product definition / IC architect team to optimize system architecture for application‑specific ICs serving India market requirements across automotive, industrial, power, and mixed‑signal applications.

• Understand customer use cases, system requirements, cost targets, and application constraints to optimize architecture

• Cover a broad technical span, ranging from analog signal‑chain products to high‑power delivery with digital controllers.

• Drive architecture trade‑offs across performance, integration level, BOM cost, manufacturability, qualification effort, and reuse of existing Renesas technology.

Cross-Business Unit IP Reuse & Collaboration

• Map target architectures to available IP across different business units within Renesas and identify gaps requiring new development.

• Collaborate with multiple business units, system engineering, analog packaging, back‑end, design, test, and operations teams to execute the development plan.

• Repurpose existing resources and IP wherever practical, while being clear where reuse creates unacceptable product, schedule, or execution risk.

• Create structured technical alignment across stakeholders who may have different priorities, schedules, and ownership models.

Development Execution

• Lead development programs through concept definition, architecture, specification, planning, execution, verification, validation, qualification, and production handoff.

• Build execution plans that include ownership, milestones, technical risks, resource needs, cost assumptions, and decision gates.

• Ensure development choices are grounded in realistic foundry, packaging, test, DFT, qualification, and manufacturing constraints.

• Collaborate with system engineering teams to define IC requirements and ensure the product solves real application‑level problems.

Automotive Quality, DFT & Reliability Planning

• Understand automotive qualification requirements for integrated circuits during design planning and translate them into execution needs.

• Plan required DFT structures, test coverage, reliability flows, and production test implications early in the design phase.

• Understand system-level fault behavior, protection needs, and safety‑related requirements where relevant to automotive and industrial applications.

• Create a practical bridge between product ambition and qualification realities, including schedule, cost, and silicon iteration risk.

Team Building & Technical Leadership

• Identify critical skill‑set requirements and hire the right people for the development team.

• Build and mentor a high‑quality technical team, including architecture, design, verification, validation, and execution contributors.

• Assess technical depth during hiring and avoid over‑reliance on surface‑level experience claims.

• Represent the program in senior leadership reviews with clear choices, trade‑offs, risks, and asks.

Qualifications

• 15+ years of experience in mixed‑signal IC, analog IC, power IC, or related semiconductor product development.

• Bachelor or Masters of Electronics Engineering related discipline from a reputed institution.

• Experience in leading IC development with multiple functional teams is a must for this role.

• Good understanding of history and future trends in semiconductor industry.

• Awareness of foundry capabilities for different CMOS, BCD and FET technologies will be an added advantage.

• Understanding of automotive qualification requirements for integrated circuits in the design phase and ability to plan execution with required DFT circuits.

• Good understanding of advanced semiconductor packaging technologies and their impact on cost, thermal performance, integration, and manufacturability.

• Previous experience in building a team from scratch.

• Comfort and ability to collaborate and be effective in an entrepreneurial (fast‑paced and ambiguous) environment.

• Excellent interpersonal, communication and presentation skills and comfort in presenting to a wide range of audiences. Capable to communicate issues in a concise and effective way.

• Desire and drive to interact with, as well as ability to build and maintain excellent relationships with internal and external stakeholders.

• Product ownership mentality with strong affinity to technical depth.

• Self‑driven, strongly motivated individual capable to take full ownership of their activities, and to involve other functions in the company or management when needed to bring them to a successful outcome.

• Should be motivated to handle unknowns of a beginner.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.