Customer Platform, SDK & Interoperability Architect

Kandou AI; Hyderabad; On-site; INR 4,000,000 - 7,000,000; Full time

Job summary

Kandou AI is hiring a Customer Platform, SDK & Interoperability Architect in Hyderabad to lead the customer-facing software platform, APIs, and toolchains across NIC, switch platforms and BMCs.

You will own C/C++ and Python development, define stable interfaces, and drive interoperability through cross-functional collaboration with firmware, validation and field engineering teams. This is a senior, architect-level role in a high-speed hardware environment.

Qualifications

• 10+ years of platform, embedded or systems software experience with architecture or leadership on shipping products.
• Device-adjacent software experience on networking silicon, AEC/AOC, optical modules, retimers or high-speed hardware.
• Experience designing adaptation, plugin or hook-based architectures with stable interfaces.
• Strong API and SDK architecture skills with C/C++ and Python development.
• Customer/OEM integration experience across NICs, switch platforms and BMCs.

Responsibilities

• Architect the customer-facing software platform for Randa, including the adaptation layer, SDK, diagnostic tools, telemetry interfaces and reference integrations.
• Define stable APIs, extension points and versioning contracts that support customer-specific requirements without forking the core platform.
• Own C and Python management libraries, command-line tools, log-analysis utilities and developer documentation.
• Lead interoperability and qualification across NIC, switch-ASIC and host-BMC platforms; maintain test matrix and regression strategy.
• Represent Kandou software in customer discussions and escalations, turning field requirements into reusable platform capabilities.
• Partner with firmware, platform validation, product management and field engineering to deliver secure, backward-compatible releases.

Skills

API architecture

SDK architecture

C/C++ development

Python development

customer communication

cross-functional leadership

Education

BS in Electrical Engineering or Computer Science

Tools

I2C/SMBus

MCTP

Job description

Customer Platform, SDK & Interoperability Architect

https://www.thecube.net/events/nyse/ai-factory-data-center-of-the-future/content/Videos/d1ad8af3-1424-4336-a9b3-1d02b5a354b4

we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

our architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

Customer Platform, SDK & Interoperability Architect

Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy efficient chip‑chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of not just the customers of today, but of tomorrow too. If you love to be part of a high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an opportunity for you.

Responsibilities

• Architect the customer-facing software platform for Randa, including the adaptation layer, SDK, diagnostic tools, telemetry interfaces and reference integrations.
• Define stable APIs, extension points and versioning contracts that support customer‑specific requirements without forking the core platform.
• Own C and Python management libraries, command‑line tools, log‑analysis utilities, integration examples and developer documentation.
• Lead interoperability and qualification across NIC, switch‑ASIC and host‑BMC platforms; maintain the test matrix, known‑failure catalog and regression strategy.
• Represent Kandou software in customer technical discussions and escalations, converting field requirements into governed, reusable platform capabilities.
• Partner with firmware, platform validation, product management and field engineering to deliver secure, backward‑compatible and supportable customer releases.
• 10+ years of platform, embedded or systems software experience, including architecture or technical leadership on shipping products.
• Device‑adjacent software experience on networking silicon, AEC/AOC, optical modules, retimers, storage or comparable high‑speed hardware.
• Strong API and SDK architecture skills with hands‑on C and/or C++ plus Python development.
• Experience designing adaptation, plugin or hook‑based architectures that isolate customer‑specific logic behind stable interfaces.
• Customer or OEM integration experience across NICs, switch platforms, BMCs, drivers or management software.
• Experience with semantic versioning, backward compatibility, release governance and technical documentation for external developers.
• Working knowledge of hardware management and sideband interfaces such as I2C/SMBus, MCTP or similar protocols.
• Excellent customer communication, technical decision‑making and cross‑functional leadership skills; BS in Electrical Engineering, Computer Engineering or Computer Science, or equivalent experience.

Useful Experience

• CMIS, OSFP MSA, SFF conventions or pluggable‑module management software.
• Hyperscaler or tier‑one OEM qualification and field‑issue triage.
• REST, gRPC, Go or Rust bindings, and schema‑driven API development.
• Telemetry pipelines, diagnostic analytics and privacy‑aware customer data handling.
• Hardware‑in‑loop lab automation, host emulation and automated interoperability testing.
• Secure software supply chain, artifact signing, access isolation and standards‑group participation.