Co-packaged Optics Engineer

QpiSemi; Bengaluru; Presencial; INR 1.800.000 - 3.000.000; Jornada completa

Descripción de la vacante

QpiSemi in Bengaluru seeks a Co-Packaged Optics (CPO) Engineer to develop and validate high‑performance optical interconnects for AI and HPC infrastructure. You will collaborate with hardware, photonics, and packaging teams to move dense optical engines from R&D to high‑volume manufacturing.

The role emphasizes multi‑chiplet integration, optical simulation, packaging processes, and rigorous electro‑optical testing with a focus on reliability and scalable production in a fast-paced environment.

Formación

• Ph.D. or Master's in Optical Engineering, Physics, Electrical Engineering, or related field.
• 3–5+ years in silicon photonics and advanced 2.5D/3D packaging (CoWoS/EMIB).
• Proficiency with optical/electromagnetic solvers (Lumerical, Ansys, Zemax, Synopsys).
• Hands-on testing with optical metrology equipment and lab automation (Python/LabVIEW).
• Knowledge of optical loss, high-speed SerDes, failure modes (FMEA), and reliability modeling.

Responsabilidades

• Design and validate next-generation optical interconnects for AI and HPC data centers.
• Collaborate with hardware, photonics, and packaging teams to transition from R&D to high-volume manufacturing.
• Model and evaluate coupling structures to minimize loss and define tolerances.
• Develop package-level assembly processes, including fiber-to-chip alignment and thermal management.
• Drive DFx/DFM guidelines with foundries and OSATs to scale prototypes to production.

Conocimientos

Optical engineering understanding

Reliability modeling

Test automation

Lab instrumentation

Educación

PhD or MSc in Optical Engineering or related field

Herramientas

Lumerical

Ansys

Zemax

Synopsys

Descripción del empleo

This comprehensive Co-Packaged Optics (CPO) Engineer job description outlines a pivotal role bridging hardware, ASIC, and optical design. It is highly optimized for talent acquisition in high-performance computing (HPC) and artificial intelligence (AI) infrastructure.

About the Role

As a Co-Packaged Optics (CPO) Engineer, you will develop and validate next-generation optical interconnects for artificial intelligence and hyperscale data center platforms. Working closely with hardware, photonic, and packaging teams, you will design, simulate, and transition dense optical engines from R&D to high-volume manufacturing.

key Responsibilities

• CPO Architecture & Co-Design: Collaborate with system architects to design multi-chiplet heterogeneous integration packages, tightly coupling Photonic Integrated Circuits (PICs) with high-speed ASICs (e.g., GPUs/switches) on a shared silicon substrate.
• Optical Simulation & Packaging: Model and evaluate optical coupling structures (grating/edge couplers, lenses, fiber arrays) to minimize optical loss, improve coupling efficiency, and define alignment tolerances.
• Process Development: Develop package-level assembly processes—including both passive and active fiber-to-chip alignment strategies, hybrid bonding, and thermal management.
• Validation & Testing: Execute electro-optical characterization (EO, OE, OO) measuring bandwidth, BER (Bit Error Rate), and eye diagrams. Define accelerated testing plans for reliability and qualification (Telcordia, JEDEC).
• Supply Chain Collaboration: Engage with foundries, OSATs, and CMs to drive Design for Manufacturing (DfM) guidelines and scale prototypes into High-Volume Manufacturing (HVM).

Qualifications & Requirements

• Education: Ph.D. or Master’s degree in Optical Engineering, Physics, Electrical Engineering, or a related discipline.
• Experience: 3–5+ years of hands-on industry experience in silicon photonics and advanced 2.5D/3D packaging platforms (e.g., CoWoS, EMIB).
• Simulation Skills: Proficiency with industry-standard optical and electro-magnetic solvers (e.g., Lumerical, Ansys, Zemax, Synopsys).
• Testing & Lab Proficiency: Hands-on experience with optical test and metrology equipment, probe stations, and test automation (Python/LabVIEW).
• Domain Knowledge: Strong grasp of optical loss mechanisms, high-speed SerDes, failure modes (FMEA), and reliability lifetime modeling.