Silicon Architecture Intern — Hybrid, Hands-on Innovation

Intel Corporation; Leixlip; Hybrid; EUR 28,000 - 35,000; Full time

Benefits offered by this job

Hybrid work model

Job summary

Intel Corporation in Ireland (Leixlip) invites an Undergraduate Intern to contribute to silicon architecture design through modeling, simulation, and analysis of architecture features.

You will work closely with experienced engineers, validate components, draft technical reports, and help optimize performance and power. The internship runs six to eight months in 2027, with a hybrid work arrangement and a starting window between January and June.

Qualifications

• Currently pursuing a Level 8 or Level 9 degree in Electronic Engineering, Computer Engineering, Physics, Computer Science or equivalent.
• Available for six to eight months in 2027 with a preferred start between January and June.

Responsibilities

• Assist in develop­ment, modeling, and simulation of silicon architecture features to evaluate functionality and performance.
• Analyze architectural designs to optimize efficiency, scalability, and power consumption.
• Collaborate with engineers to validate components and ensure alignment with system requirements.
• Create technical documentation and reports summarizing findings and recommendations.
• Participate in team meetings to support innovative engineering solutions.

Skills

Python

C

C++

simulation tools

Education

Level 8/9 Engineering/CS

Tools

Simulation tools

Job description

Intel Corporation in Ireland (Leixlip) invites an Undergraduate Intern to contribute to silicon architecture design through modeling, simulation, and analysis of architecture features.

You will work closely with experienced engineers, validate components, draft technical reports, and help optimize performance and power. The internship runs six to eight months in 2027, with a hybrid work arrangement and a starting window between January and June.