Senior Researcher in Component Fabrication and Integration for Advanced Packaging Technologies

tyndallnationalinstitute

Ireland

Hybrid

EUR 73,000 - 93,000

Full time

14 days+
Application generator

Don’t send a generic resume — generate a resume and cover letter tailored to this exact role.

Get past ATS filters

Benefits offered by this job

Hybrid working
Pension
Annual leave
Professional development
Research infrastructure

Job summary

Tyndall National Institute in Ireland invites applications for a Senior Researcher in Component Fabrication and Integration for Advanced Packaging Technologies. The role focuses on developing advanced fabrication and integration technologies for photonic and electronic systems, including hybrid and heterogeneous integration, with access to state‑of‑the‑art facilities.

The successful candidate will lead projects, develop collaborations with academia and industry, mentor researchers, and

Qualifications

  • PhD with extensive academic/industrial experience (8 years typical).
  • Strong technical expertise in semiconductor fabrication and integration.
  • Experience in packaging and integration technologies, including hybrid/heterogeneous approaches.
  • Experience managing technical projects in electronics/photonic fields with leadership accountability.
  • Experience preparing and submitting proposals for large funded projects with partner coordination.

Responsibilities

  • Provide technical leadership in fabrication and integration for advanced packaging technologies.
  • Lead and manage research projects with timely delivery of objectives.
  • Develop new research activities aligned with the group’s strategy.
  • Prepare major funding proposals and coordinate technical activities with partners.
  • Build collaborations with academic, industrial, and research partners.
  • Mentor researchers and engineers within the group and promote a collaborative environment.
  • Support transition of outputs toward scalable manufacturing and pilot lines (e.g., PIXEurope).
  • Represent the group at conferences, workshops, and stakeholder meetings.
  • Participate in Education and Public Engagement activities.
  • Ensure compliance with Quality Management Systems and Health & Safety standards.
  • Carry out additional duties within the scope of the post.

Skills

Photonic components
Semiconductor fabrication
Integration technologies
Project leadership
Proposal writing

Education

PhD

Tools

InP
Silicon photonics
Interposers

Job description

Senior Researcher in Component Fabrication and Integration for Advanced Packaging Technologies
About Tyndall

Tyndall National Institute is an international leader in semiconductors, photonics and deep-tech research and innovation. As a leading collaborative European research institute, Tyndall is a key actor and hosting partner in the delivery of the ‘Chips for Europe Initiative’ (EU Chips Act).

Tyndall is Ireland’s leading research and innovation organisation and it is the national focal point for excellence in deep-tech research, development and graduate training at the convergence of nanotechnology, microelectronics, photonics, electronics and AI. Tyndall is recognised as an international research leader in semiconductor, chip and digital technologies, particularly as applied to the fields of Information & Communications, Health & Life Sciences, Agritech & Food Security, Energy and Climate Mitigation, emerging fields such as quantum, and novel computing paradigms.

The Institute’s key objective is to see frontier research activities having a significant impact on economic development and societal challenges in Ireland, Europe and beyond. Central to Tyndall’s mission is delivering economic impact through research excellence in partnership with industry and academia. With an annual turnover of more than €50m, the Institute has a community of over 600 researchers, engineers, support staff, postgraduate students, interns and industry researchers-in-residence.

With significant committed Irish government support, Tyndall will grow to be 1,000 people by 2030, with approximately 750 researchers, including 250 PhD students. A new 17,000 m2 research building is under development adjacent to the Cork headquarters and there are developing plans to expand Tyndall’s existing Dublin research labs and to establish other research sites within Ireland.

Tyndall’s expansion is also supported by recent national and EU funding wins for significant (M€10’s) additional research equipment across a range of areas such as semiconductor processing, microscopy, quantum technologies, heterogeneous integration, ultra-high speed optical communications and RF through THz characterisation.

About the Team

The Photonics Packaging and Systems Integration Group at Tyndall National Institute invites applications for the position of Senior Researcher in Component Fabrication and Integration for Advanced Packaging Technologies. This role focuses on the development of advanced component fabrication and integration technologies for photonic and electronic systems, including hybrid and heterogeneous integration approaches. The successful candidate will contribute to the development and optimisation of materials, processes, and integration methodologies that support next-generation packaging solutions and can be transferred to scalable manufacturing environments, including pilot line activities such as PIXEurope.

About the Role

A key aspect of the role will be the development of advanced integration platforms and processes that enable the combination of diverse photonic, electronic, and optoelectronic technologies within highly integrated systems. The role will leverage Tyndall's advanced fabrication, packaging, and characterisation facilities to develop innovative solutions that address emerging challenges in communications, sensing, computing, and other advanced technology applications. The successful candidate will provide technical leadership in component fabrication and integration activities, lead research and technical projects, contribute to major funding proposals, develop collaborations with academic and industrial partners, and support the growth and development of researchers and engineers within the group.

Key Duties & Responsibilities
  • Provide technical leadership in component fabrication and integration for advanced packaging technologies, with a focus on photonic and electronic systems and hybrid or heterogeneous integration processes.
  • Lead and manage technical and research projects, ensuring timely delivery of project objectives and high-quality outcomes.
  • Contribute to the development of new research and technical activities aligned with the group’s strategic direction.
  • Play a significant role in the preparation and development of major research and technical funding proposals, including proposal writing, consortium building, work package planning, and coordination of technical activities.
  • Build and develop collaborations with academic, industrial, and research partners to support future funding opportunities and strategic growth.
  • Support the development and mentoring of researchers and engineers within the group, contributing to a collaborative and high-performing team environment.
  • Support the transition of research outputs toward scalable manufacturing and industry engagement, including activities linked to pilot line initiatives such as PIXEurope.
  • Represent the group through presentations, workshops, conferences, project meetings, and engagement with external stakeholders.
  • Participate in Education and Public Engagement activities.
  • Ensure compliance with Tyndall’s Quality Management Systems, Health and Safety standards, and other regulations.
  • To carry out any additional duties that may reasonably be required within the general scope and level of the post.
Essential Criteria
  • PhD qualified with typically 8 years academic and/or industrial experience.
  • Strong technical expertise in semiconductor component fabrication and integration processes, including photonic components and materials platforms such as InP, silicon photonics, and interposers.
  • Experience in component packaging and integration technologies, including hybrid or heterogeneous integration approaches.
  • Experience managing technical projects in the fields of electronics and photonics, with evidence of increasing project leadership accountability.
  • Experience of preparing and submitting successfully won proposals as well as making significant contributions to successfully funded large-scale projects, including activities such as proposal writing, consortium development, work package planning, technical leadership, partner coordination, and defining project activities and deliverables.
  • Evidence of establishing an external profile through invited talks, conference presentations, technical training activities, or participation in international collaborations.
  • Experience in building research or industry collaborations that have the potential to generate future funding opportunities, research activities, or commercial engagement.
Desirable Criteria
  • Evidence of developing a research or technical area and contributing to the growth of the group, including mentoring or supporting junior researchers and engineers.
  • Experience developing and maintaining collaborations with academic, industrial, or research partners.
  • Track record of publishing research results in peer‑reviewed journals and presenting at international conferences.
  • Experience contributing to the development of research strategy, technical roadmaps, or new research directions.
What We Offer
  • Impactful Work: Opportunities to contribute to ground‑breaking research and innovation that shape Ireland’s economy and the society at large.
  • Continuous Learning: Strong support for formal training, further study and professional development.
  • Interdisciplinary Environment: Where academia, industry, and innovation intersect - supported by cutting‑edge infrastructure and expert knowledge.
  • Blended Working: Flexibility to work remotely and on‑site, where the role allows.
  • Comprehensive Benefits: Access to UCC pension, long‑term illness benefit, life assurance, and more.
  • Generous Leave: Competitive annual leave entitlements.
  • Equity & Inclusion: Athena Swan Bronze award holder, with ongoing initiatives led by a dedicated People and Culture team to ensure equity for all.
  • Core Values: A culture grounded in Ambition, Collaboration, Diversity, Excellence, and Integrity.
  • Entrepreneurial Spirit: A proactive, innovation‑driven environment that welcomes entrepreneurial and creative thinkers, including those with start‑up experience.
  • Supportive Onboarding: Structured induction and mentoring to help new hires integrate and thrive.
  • Vibrant Culture: A collaborative, people‑first workplace with a strong sense of community.
Terms of Employment

Contract Category: Full-Time

Contract Type: Fixed Term

Appointment may be made on the Admin II Grade 6A Scale B (new entrants) salary €73,492- €93,094 per annum. Salary placement on appointment will be in accordance with the public sector pay policy.

Closing date for applications for this position is 1pm, 1st October 2026.

Informal enquiries can be made in confidence to Dr Peter O’Brien

Please note that Garda vetting and/or an international police clearance check may form part of the selection process.

Please note that an appointment to posts advertised will be dependent on university approval, together with the terms of the employment control framework for the higher education sector.

Tyndall National Institute does not require the assistance of recruitment agencies.

Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Senior Engineer II – Photonic Packaging and Process Development
Senior Engineer II – Photonic Packaging and Process Development

Tyndall National Institute • Coolmore Cross

On-site
EUR 72,000 - 91,000
Impactful Work
Learning & Development
Interdisciplinary Environment
+8
Senior Engineer II – Photonic Packaging and Process Development
Senior Engineer II – Photonic Packaging and Process Development

tyndallnationalinstitute • Cork

Hybrid
EUR 72,000 - 91,000
Hybrid working
Blended working
Pension scheme
+2
Postdoctoral Researcher - Photonics Devices
Postdoctoral Researcher - Photonics Devices

Tyndall National Institute • Coolmore Cross

Hybrid
EUR 47,000 - 60,000
Pension
Long-term illness benefit
Life assurance
+1
Postdoctoral Researcher - Photonics Devices
Postdoctoral Researcher - Photonics Devices

tyndallnationalinstitute • Cork

Hybrid
EUR 47,000 - 60,000
UCC pension
Long‑term illness benefit
Life assurance
Postdoctoral Researcher - Photonics Devices
Postdoctoral Researcher - Photonics Devices

Tyndall National Institute • Cork

Hybrid
EUR 47,000 - 60,000
Impactful work
Continuous learning
Blended working
+3
Postdoctoral Researcher – Photonics Devices
Postdoctoral Researcher – Photonics Devices

Tyndall • Cork

Hybrid
EUR 47,000 - 54,000
Athena Swan Bronze award
UCC pension
Long-term illness benefit
Post-Doctoral Researcher in Optical Design and Advanced Packaging
Post-Doctoral Researcher in Optical Design and Advanced Packaging

Tyndall National Institute • Coolmore Cross

On-site
EUR 47,000 - 54,000
Blended working
UCC pension and life assurance
Generous leave
+1
Post-Doctoral Researcher in Optical Design and Advanced Packaging
Post-Doctoral Researcher in Optical Design and Advanced Packaging

tyndallnationalinstitute • Cork

On-site
EUR 47,000 - 54,000
Blended working: remote and on-site
Competitive annual leave
UCC pension and benefits
Business Development Executive (EU Pilot Lines)
Business Development Executive (EU Pilot Lines)

Tyndall National Institute • Cork

Hybrid
EUR 73,000 - 93,000
Blended working
Pension and benefits
Research Fellow Technology Computer Aided Design – Materials Modelling for Devices Group
Research Fellow Technology Computer Aided Design – Materials Modelling for Devices Group

Tyndall National Institute • Ireland

On-site
EUR 67,000 - 73,000
UCC pension
Long-term illness benefit
Life assurance
+2