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Tyndall National Institute in Ireland seeks a Senior ALD Process Engineer to lead development, optimisation and operation of ALD and related thin‑film processes for next‑generation semiconductor devices.
You will design DoEs, mentor researchers, and collaborate across teams while enabling robust, scalable deposition workflows and integration into wider fabrication flows. The role emphasizes ALD for TMDs/oxide semiconductors/high‑k materials with a strong safety and documentation focus.
Tyndall National Institute is Ireland’s largest Research and Technology Organisation (RTO) and a flagship Institute of University College Cork. Specialising in both electronics and photonics, Tyndall works with global industry and academia to transform research into products in its core market areas of electronics, communications, energy, health, agri-tech and the environment. With a network of over 200 industry partners and customers worldwide, Tyndall is focused on delivering human and economic impact from excellence in research.
Tyndall is home to a research community of 650 people of over 50 nationalities.
Within Tyndall’s Micro Nano Systems Centre, we have created a strategic research programme focusing on materials, emerging devices and architectures for future information processing, interfacing with CMOS and beyond (“CMOS++ Materials & Devices”).
CMOS++ is involved in the Chips JU NanoIC pilot line co-funded by the European Commission and national agencies as part of the targeted initiatives of the EU Chips Act. The implementation of the Chips JU pilot lines is expected to bridge the gap from lab to fab and will be available to a wide range of users, including academia, industry and research institutions.
The NanoIC pilot line is the result of a remarkable European cross‑border collaboration. Hosted by imec (Belgium), its partners include CEA‑Leti (France), Fraunhofer (Germany), VTT (Finland), CSSNT (Romania) and Tyndall National Institute (Ireland).
NanoIC targets semiconductor technologies that will shape tomorrow’s high‑tech solutions. One of the main goals is to develop the process steps and modules that enable these technologies. This will result in stable ‘platform’ baseline flows with a high technology readiness level (TRL 4-6).
In NanoIC, Tyndall’s flexibility into materials integration will allow for rapid, short‑cycle screening to reduce the cycle time in identifying and integrating highly performing materials to carry forward into IC development. Our role is to provide agile wafer scale nanofabrication and processing beyond silicon for the integration of selected new materials – Transition Metal Dichalcogenides (TMDs) and oxide semiconductor (OSC) – and FET device architectures. The goal is to develop a material platform for embedded DRAM and above IC functionality, thereby providing a key technology block to enable leading‑edge ICs.
The Senior ALD Process Engineer will play a key role in the success of Tyndall’s NanoIC programme, providing technical leadership and hands‑on expertise in the development, optimisation and operation of Atomic Layer Deposition (ALD) and related thin‑film processes for emerging materials and next‑generation semiconductor devices.
The role will focus on establishing robust, repeatable and scalable ALD processes, maintaining stable and reliable tool operation, and translating materials and device concepts into well‑controlled deposition processes. The postholder will work directly within Tyndall’s fabrication and materials environments, undertaking process development, experimentation, characterisation, troubleshooting and process optimisation, while providing technical guidance to researchers, engineers and other users of the ALD capability.
Particular emphasis will be placed on the development of ALD processes for transition metal dichalcogenides (TMDs), oxide semiconductors and high‑k dielectric materials, as well as their integration into advanced device architectures. The role will contribute to the development of thin‑film interfaces and multilayer structures for next‑generation transistors, including field‑effect transistors (FETs) and MOSFETs, with an emphasis on achieving the required material, interface, electrical and device performance.
The Senior ALD Process Engineer will work closely with process engineers, device engineers, materials scientists, researchers, metrology specialists, equipment engineers and external equipment suppliers. They will identify process challenges, establish process windows and optimise deposition conditions through structured experimentation, Design of Experiments (DoE), process characterisation and data‑driven analysis. The role will also support the installation, commissioning and qualification of new ALD equipment, technology development, process transfer, knowledge exchange and mentoring within the NanoIC programme.
Support the integration of ALD processes into wider semiconductor fabrication flows, assessing material compatibility, contamination risk, precursor chemistry, chamber effects, thermal‑budget constraints and interactions with upstream and downstream process modules. The role will support process transfer from laboratory‑scale demonstrations towards repeatable wafer‑scale fabrication, including process qualification and technology transfer. Develop and maintain comprehensive documentation for process recipes, operating procedures, equipment conditions, process windows, experimental plans, metrology results and process‑development outcomes.
Provide technical guidance and mentoring to junior engineers, interns, students and researchers, work effectively across multidisciplinary teams, and promote knowledge sharing and continuous improvement. Participate in Education and Public Engagement activities. Contribute to risk assessment, quality management and equipment qualification, ensuring compliance with Health and Safety requirements, cleanroom and hazardous‑material procedures, the Tyndall Quality Management System, and other duties appropriate to the scope and level of the post.
Other duties as assigned by the Director of Innovation & Industry Engagement when required.
Contract Type: Fixed Term
Contract Category: Full Time
The duration of the contract is a for a fixed term of approximately 24 months with the possibility to extend by 18 months upon the availability of funding, satisfactory performance, mutual agreement and a detailed career development plan.
Appointment may be made on the UCC Senior Technical Officer Salary Scale B €67,875 – € 78,185 p.a.. Salary placement on appointment will be in accordance with the public sector pay policy.
Informal enquiries concerning this position can be made to Melissa McCarthy
The closing date for applications is 1pm 19th October 2026
At this time, Tyndall National Institute does not require the assistance of recruitment agencies.
Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.