Lead PCIe & CXL Embedded Firmware Engineer

QUALCOMM, Inc.; Cork; Remote; EUR 120,000 - 180,000; Full time

Benefits offered by this job

Salary and bonus

Maternity/Paternity Leave

Employee stock purchase scheme

Matching pension scheme

Education Assistance

Relocation support

Insurance

Well-being programs

Clubs and activities

Job summary

QUALCOMM, Inc. in Cork, Ireland, invites a Staff Embedded Software Engineer to design, implement, and optimize firmware and drivers for PCIe and CXL subsystems.

You will work closely with hardware architects to ensure high performance, low power, and reliable interconnect firmware across next-generation chipsets. Key responsibilities include low-level software development, platform bring-up, and collaboration with cross-functional teams to meet industry standards and drive architectural planning

Qualifications

• Bachelor's degree or higher in a relevant field with multiple years of software experience.
• Proven expertise in embedded software development across firmware and drivers.
• Experience with PCIe, CXL, RTOS, and platform bring-up is required.

Responsibilities

• Design, develop, debug, and commercialize embedded firmware and drivers for PCIe and CXL subsystems.
• Collaborate with cross-functional teams to ensure seamless hardware-software integration.
• Optimize software for performance, power efficiency, and reliability.
• Contribute to architectural discussions and future chipset planning.

Skills

C

C++

Java

Python

RTOS

Linux kernel

Zephyr

ACPI

UEFI

PCIe

CXL

Education

Bachelor's degree in Engineering, Information Systems, Computer Science, or related field

Master's degree in Engineering, Information Systems, Computer Science, or related field

PhD in Engineering, Information Systems, Computer Science, or related field

Job description

QUALCOMM, Inc. in Cork, Ireland, invites a Staff Embedded Software Engineer to design, implement, and optimize firmware and drivers for PCIe and CXL subsystems.

You will work closely with hardware architects to ensure high performance, low power, and reliable interconnect firmware across next-generation chipsets. Key responsibilities include low-level software development, platform bring-up, and collaboration with cross-functional teams to meet industry standards and drive architectural planning