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PCB Designer

Outsource UK lTD

Portsmouth

Remote

GBP 80,000 - 100,000

Full time

Today
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Job summary

A leading defense contractor is seeking a PCB Designer for a remote role lasting 6 months, with potential for extension. The role involves generating approximately 30 PCB designs per year and requires proficiency with the Cadence Allegro toolset. Candidates should have experience in designing complex PCBs and collaborating with design teams. Minimum working hours are 37 per week, with an hourly rate of £51.60 PAYE or £69.65 Umbrella.

Qualifications

  • Proficient experience with Cadence Allegro toolset is mandatory.
  • Experience designing complex, multi-layer PCBs required.

Responsibilities

  • Generate approximately 30 PCB designs per year.
  • Undertake PCB design activities from initial concepts to manufacturing data packs.
  • Collaborate closely with mechanical and electronic design teams.

Skills

Proficient experience of Cadence Allegro toolset
PCB design techniques for large, complex, multi-layer, multi-substrate, PCBs
Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies
Experience of blind, buried, and filled via techniques
Experience of flexible PCB and interconnecting assemblies
Job description

Client: BAE Systems

Role: PCB Designer

Location: Remote

Duration: 6 months - opportunity to be extended

Working arrangements: Minimum 37 hours per week

Hourly Rate: £51.60 PAYE or £69.65 Umbrella

Key Responsibilities
  • Be part of a small team generating approximately 30 PCB designs per year.
  • Undertake PCB design activities from initial concepts through to generation of manufacturing data packs.
  • Apply knowledge, technical skills and general engineering experience to generate PCB designs.
  • Interpretation, generation, and management of schematic diagrams.
  • Collaborate closely with the mechanical and electronic design teams.
Skills & Qualifications
  • Proficient experience of Cadence Allegro toolset - mandatory
  • PCB design techniques for large, complex, multi-layer, multi-substrate, PCBs.
  • Designing for controlled impedance, high speed digital, RF, mixed signal, high current, and large FPGA technologies.
  • Experience of blind, buried, and filled via techniques.
  • Experience of flexible PCB and interconnecting assemblies.

If you would like to be considered for this role please don't hesitate to click apply or call Sam Pierre-Louis on 0161 383 8022 for more information...

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