Graduate R&D Engineer — Capacitive Touch & Embedded

Microchip Technology Inc.

Winchester

On-site

GBP 26,000 - 36,000

Full time

14 days+

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Job summary

Microchip Technology Inc. is seeking a graduate or early-career engineer (up to 3 years’ experience) to join the Human Machine Interface Division in developing next‑generation capacitive sensing solutions for automotive and industrial systems.

You will define requirements for silicon and firmware, create architecture concepts, and support design, validation, and product delivery across global teams. You will contribute to analogue front-end design, embedded firmware, and system optimization

Qualifications

  • BEng (or equivalent) in Electronics Engineering, Communication Engineering, or a related discipline.
  • Graduates or candidates with up to 3 years’ experience in an electronics/software environment.
  • Industry experience is beneficial but not essential.

Responsibilities

  • Define requirements for new silicon and firmware features based on product and customer needs.
  • Contribute to the development of new system and architecture concepts for future generations of touch solutions.
  • Analyse and optimise analogue and digital hardware implementations to improve system performance.
  • Develop efficient embedded software to control measurement systems and process acquired data.
  • Investigate and solve customer issues, delivering robust and innovative solutions.
  • Collaborate with cross-functional and global teams on design, validation, and product development.
  • Produce clear technical documentation, including specifications, design descriptions, and test plans.

Skills

Microcontroller architecture
C programming
Python
Analogue/digital design
Signal processing
Scripting (Python, Matlab)
AI tools familiarity

Education

BEng (or equivalent) in Electronics/Communication Engineering

Job description

Microchip Technology Inc. is seeking a graduate or early-career engineer (up to 3 years’ experience) to join the Human Machine Interface Division in developing next‑generation capacitive sensing solutions for automotive and industrial systems.

You will define requirements for silicon and firmware, create architecture concepts, and support design, validation, and product delivery across global teams. You will contribute to analogue front-end design, embedded firmware, and system optimization

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