Senior PCB Layout Engineer – High-Speed Electronics, Hybrid

Hirewand

Kaustinen

Hybrid

EUR 48,000 - 68,000

Full time

10 days ago

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Benefits offered by this job

Flexible/hybrid work
Occupational healthcare
Professional development
Wellness benefits
Modern labs

Job summary

Sasken Finland Oy is seeking a PCB Layout Engineer to join our Hardware Engineering team in Kaustinen or Tampere. You will own demanding PCB layouts, work with RF, embedded software, and mechanical teams, and influence EMC, manufacturability, and time-to-market.

You will design complex multilayer PCBs, define stack-ups, and create fab documentation, while collaborating across disciplines to ensure production-ready hardware.

Qualifications

  • Detailed experience in PCB layout design for complex electronics.
  • Ability to read, review, and understand schematics.
  • Knowledge of multilayer PCB stack-up design and routing methodologies.
  • Understanding of signal integrity, power integrity, EMC, EMI, DFM, and DFA principles.
  • Experience with PCB design tools: Mentor Xpedition, PADS, Altium, Cadence Allegro.

Responsibilities

  • Own demanding PCB layout work across the hardware development lifecycle.
  • Design complex multilayer PCB layouts for advanced electronic products.
  • Collaborate with electronics engineers during schematic design.
  • Define PCB stack-ups, routing strategies, and layout rules.
  • Create manufacturing documentation and support PCB fabrication/assembly.
  • Prototype bring-up, debugging, verification, and production support.
  • Coordinate with mechanical, suppliers, and manufacturing partners.

Skills

PCB layout
Schematic reading
Signal integrity
Power integrity
Multilayer stack-up
EMC concepts
English communication

Tools

Mentor Xpedition
PADS Professional
Altium Designer
Cadence Allegro

Job description

Sasken Finland Oy is seeking a PCB Layout Engineer to join our Hardware Engineering team in Kaustinen or Tampere. You will own demanding PCB layouts, work with RF, embedded software, and mechanical teams, and influence EMC, manufacturability, and time-to-market.

You will design complex multilayer PCBs, define stack-ups, and create fab documentation, while collaborating across disciplines to ensure production-ready hardware.

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