As a Product Engineer, you will bridge the gap between chip design, foundry manufacturing (FAB), assembly houses, and test operations in a fabless semiconductor environment. Combining hands-on subcontractor management with advanced test data analytics, statistical modeling, and data structure expertise, you will ensure high product yield, zero-defect quality, and cost-effective mass production
Your responsibilities
- Execute, qualify, and release production test programs (Wafer Sort & Final Test) at global OSATs.
- Analyze large-scale production test datasets to identify yield trends, perform Pareto analyses, and detect parametric outliers.
- Maintain, query, and structure yield databases to streamline data extraction, build tracking dashboards, and enable automated reporting workflows.
- Drive root-cause identification and rapid resolution for yield drops, low-yield lots, equipment excursions, and electrical failure analysis (EFA) on the production floor.
- Apply Statistical Process Control (SPC) and Six Sigma methods to monitor device limits, Cpk/Ppk metrics, and spatial wafer maps.
- Act as the technical liaison connecting FAB, assembly/packaging houses, and test operations to optimize yields and reduce test times.
- Collaborate closely with Test Development, Logistics, and Quality teams to deliver compliant products on time while ensuring strict automotive and industrial quality standards.
Your Skills and Experience
- Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, Computer Engineering, or a related technical field.
- Hands-on experience with semiconductor production test data analysis tools (e.g., YieldMan, Exensio/PDF Solutions, Galaxy Semiconductor, JMP, Spotfire).
- Solid understanding of database structures (SQL, relational databases, STDF data parsers) and proficiency in querying and manipulating structured test data.
- Strong proficiency in statistical methods (SPC, Gauge R&R, ANOVA, Six Sigma methodologies).
- In-depth knowledge of wafer fabrication, assembly processes, and test flows (Wafer Sort and Final Test).
- Structured, precise, and independent approach to analytical problem-solving.
- Good team player with excellent communication skills, both verbal and written
- Fluent in English; German language skills are a plus
Preferred Qualifications ("Bonus Points")
- Experience working directly with external semiconductor subcontractors and OSATs.
- Scripting and automation skills (e.g., Python, R, Perl, Tcl) for test data processing pipelines.
- Knowledge of automotive quality standards (e.g., AEC-Q100, IATF 16949) and assembly packaging processes.
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