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Speedgoat in Bern, Switzerland, offers a paid internship in the HW Design team within the HIL Systems department. You will support practical electronics work for rack systems, connectivity, and the MSCP, gaining hands-on PCB design experience on real customer projects.
You'll collaborate with experienced engineers, learn modern engineering workflows, and contribute to signal conditioning concepts, testing, and assembly‑related design work.
You will join the HIL Systems department, which delivers customer‑specific HIL test systems for electronic control units and complete turnkey test benches. Within the HW Design team, you will support practical electronics work for rack systems, connectivity, and the Modular Signal Conditioning Platform (MSCP). You will collaborate with experienced engineers and gain insight into real customer projects across many industries. This job is ideal for bachelor’s or master’s students, or candidates with a comparable background in electronics engineering, who want to turn theory into hands‑on engineering experience. You will contribute to practical PCB design, signal conditioning concepts, and assembly‑related design work used in real HIL systems. It is a strong opportunity to experience a high‑tech industry from the inside, learn modern engineering workflows, and see how electronics, simulation, and real‑time testing come together in products used by leading engineering teams worldwide.