Brain-Interface Microfabrication Technician

FUTRUE; Genf; Vor Ort; CHF 90.000 - 130.000; Vollzeit

Zusammenfassung

FUTRUE Neurosciences is seeking a Microfabrication / Manufacturing Technician to support the development of brain-computer interfaces. You will assist in producing implantable micro-electrodes and operate sputter, photolithography, RIE, and laser systems.

Responsibilities include back-end assembly like wire bonding and packaging, equipment maintenance, SOP-compliant documentation, and collaboration with engineers on process improvements. Willingness to travel to Geneva for training is expected.

Qualifikationen

• At least 1 year of hands-on experience in manufacturing, preferably in cleanroom/semiconductor/mems/medical device environments.
• Able to work with small, delicate components under a microscope; strong fine motor skills.
• Follow SOPs exactly and document work diligently.

Aufgaben

• Operate and monitor microfabrication equipment: sputter systems, photolithography tools, RIE, and laser structuring systems.
• Perform back-end assembly steps, including wire bonding and packaging of finished components.
• Maintain and calibrate fabrication equipment, document processes, and support data analysis of throughput, quality, and reproducibility.
• Perform visual inspections and functional tests; report deviations and collaborate on process improvements.

Kenntnisse

Microsystems manufacturing

Cleanroom handling

Photolithography

Sputtering

Etching

Wire bonding

SOP adherence

Team player

Fine motor skills

Ausbildung

High school diploma or equivalent

Technical vocational training in microfabrication (e.g., microtechnologist, precision mechanic, electronics technician)

Tools

Photolithography tools

Sputter systems

Reactive ion etchers (RIE)

Laser structuring systems

Wire bonding equipment

Jobbeschreibung

FUTRUE Neurosciences is seeking a Microfabrication / Manufacturing Technician to support the development of brain-computer interfaces. You will assist in producing implantable micro-electrodes and operate sputter, photolithography, RIE, and laser systems.

Responsibilities include back-end assembly like wire bonding and packaging, equipment maintenance, SOP-compliant documentation, and collaboration with engineers on process improvements. Willingness to travel to Geneva for training is expected.