AI-Driven Postdoc: Autonomous Thin-Film & PVD Research

1000scholars; Dübendorf; On-site; CHF 90,000 - 120,000; Full time

Job summary

Empa invites applications for a Postdoctoral Researcher position focused on developing thin films and deposition processes using AI and autonomous experiments. Based in Dübendorf, you will operate at the interface of experimental materials science and materials informatics, collaborating within an interdisciplinary team.

You will conduct PVD experiments, utilize high-throughput workflows, and apply AI/ML to optimize processes and materials properties, contributing to next‑generation devices and

Qualifications

• PhD in physics, materials science, chemistry, electrical engineering or related discipline.
• Knowledge of UHV and thin-film technology is preferred.
• Experience with PVD and surface science is desired.

Responsibilities

• Conduct physical vapor deposition experiments using advanced PVD processes such as synchronized HiPIMS.
• Perform in-depth materials characterization and surface analysis.
• Apply and improve high-throughput experimental workflows including closed-loop thin-film optimization.
• Apply AI and Machine Learning for data analysis and modelling.
• Develop, improve and implement HW/SW concepts to automate experiments and enable autonomous experiments.

Skills

Python programming

Lab automation

AI / machine learning

PVD

Surface analysis

English communication

Education

PhD in physics, materials science, chemistry, electrical engineering or related discipline

Tools

HiPIMS

RHEED

AES

XPS

UHV systems

Sputtering

Job description

Empa invites applications for a Postdoctoral Researcher position focused on developing thin films and deposition processes using AI and autonomous experiments. Based in Dübendorf, you will operate at the interface of experimental materials science and materials informatics, collaborating within an interdisciplinary team.

You will conduct PVD experiments, utilize high-throughput workflows, and apply AI/ML to optimize processes and materials properties, contributing to next‑generation devices and