UCIe Die-to-Die Project Engineering Manager

Synopsys, Inc.; Ottawa; On-site; CAD 100,000 - 125,000; Full time

Job summary

A leading technology company is looking for an experienced engineering leader to drive innovations in UCIe die-to-die interfaces and advanced packaging. You will manage complex projects, lead cross-functional teams, and enhance collaboration to deliver high-performance chiplet-based systems. The role requires strong expertise in semiconductor design and excellent communication skills. Join a multidisciplinary engineering team that values innovation and inclusion based in Ottawa or Toronto.

Benefits

Comprehensive health benefits

Financial wellness offerings

Innovative work culture

Qualifications

• Experience in semiconductor or high-tech fields.
• Proven track record in managing complex projects.
• Ability to coordinate cross-functional teams effectively.

Responsibilities

• Lead UCIe die-to-die interface projects from concept to delivery.
• Oversee technical reviews and quality assurance processes.
• Mentor and support junior engineers.

Skills

Project management experience

Expertise in UCIe

Strong understanding of semiconductor design

Excellent communication skills

Leadership in global teams

Job description

We Are: Open to hiring for this role in Ottawa, or in Toronto

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are:

You are an experienced engineering leader with a strong background in UCIe die-to-die interfaces and advanced packaging. You excel in managing complex projects, leading cross-functional teams, and delivering high-quality solutions. Your collaborative spirit, technical acumen, and inclusive leadership style help you drive innovation and achieve results in a dynamic environment.

What You’ll Be Doing:

• Lead UCIe die-to-die interface projects from concept to delivery.
• Coordinate cross-functional teams and manage project schedules.
• Collaborate with product management and customers on requirements.
• Oversee technical reviews and quality assurance processes.
• Act as a UCIe subject matter expert for internal and external stakeholders.
• Mentor and support junior engineers.

The Impact You Will Have:

• Accelerate delivery of cutting-edge die-to-die connectivity IP.
• Shape Synopsys’ roadmap in UCIe and advanced packaging.
• Enhance collaboration and process excellence across teams.
• Enable customers to achieve high-performance chiplet-based systems.
• Promote Synopsys as a leader in the UCIe ecosystem.
• Foster a culture of innovation and inclusion.

What You’ll Need:

• Project management experience in semiconductor or high-tech fields.
• Expertise in UCIe, die-to-die interfaces, or chiplet architectures.
• Strong understanding of semiconductor design and verification flows.
• Experience leading cross-functional, global teams.
• Excellent communication and stakeholder management skills.

Who You Are:

• Inclusive, collaborative leader
• Strategic thinker
• Adaptable and organized
• Quality-focused and detail-oriented
• Motivated lifelong learner

The Team You’ll Be A Part Of:

Join a multidisciplinary engineering team focused on redefining die-to-die connectivity and advanced packaging, working closely with global partners in a culture of innovation and collaboration.

Rewards and Benefits:

We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.