Thermo Compression Bonding Engineer [Admiralty | 5 Days | $6,000–$8,000 | Oxygen & Environmenta[...]

The Supreme HR Advisory; Alberta; On-site; CAD 60,000 - 80,000; Full time

Job summary

A global recruitment firm seeks a TCB Design Engineer to develop oxygen control systems for semiconductor packaging. Key responsibilities include system design for ultra-low oxygen environments and collaboration with cross-functional teams. Candidates should have a relevant engineering degree and over 5 years of design experience in related industries. Proficiency in 3D CAD tools is essential. Position based in Alberta, offering a salary of CAD 6000-8000 depending on experience.

Qualifications

• 5+ years of experience in precision equipment design for semiconductor, display, or vacuum systems.
• Experience with oxygen and humidity control, nitrogen purge, and formic acid vapor systems.
• Proficiency in 3D CAD and thermal/flow simulation tools for system design.

Responsibilities

• Design and develop oxygen control systems for thermal compression bonding.
• Collaborate across functions to ensure system stability and safety.
• Support installation and troubleshooting at customer sites.

Skills

Oxygen control systems

Nitrogen purge systems

Cleanroom standards

3D CAD tools

Thermal/flow simulation tools

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

SolidWorks

Creo

NX

ANSYS

COMSOL

Job description

TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems

Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview

The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal Compression Bonding (TCB) processes for advanced semiconductor packaging. The role involves working with inert gas environments (Nitrogen systems), Formic Acid vapor handling, Clean Room integration, and Plasma-based oxide removal systems. The position requires cross-functional collaboration to ensure process stability, safety, and performance.

Key Responsibilities

• Design and develop oxygen control and purge systems for TCB equipment to achieve ultra-low oxygen environments.
• Develop nitrogen and formic acid gas delivery systems ensuring safety, flow uniformity, and chemical compatibility.
• Design plasma cleaning systems for oxide removal on incoming wafers and substrates prior to bonding.
• Integrate gas handling, exhaust, and pressure control modules within bonder chambers.
• Ensure compliance with cleanroom standards and contamination control requirements.
• Conduct CFD and thermal analysis to evaluate gas flow, heat distribution, and oxygen diffusion during bonding.
• Select appropriate materials for components exposed to formic acid, plasma species, and high temperatures.
• Develop safety interlocks and control schemes for handling flammable or corrosive gases.
• Collaborate with process, equipment, and controls engineers to align designs with process needs.
• Support installation, commissioning, and troubleshooting at customer or manufacturing sites.

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering or related discipline.
• Minimum 5+ years of experience in precision equipment design for semiconductor, display, or vacuum systems.
• Experience with oxygen and humidity control, nitrogen purge, and formic acid vapor systems.
• Experience with plasma cleaning or surface activation systems.
• Proficiency in 3D CAD tools (SolidWorks, Creo, or NX) and thermal/flow simulation tools (ANSYS, COMSOL).
• Understanding of chemical compatibility, gas flow control, and vacuum-sealing techniques.
• Familiarity with TCB, CoWoS, or hybrid bonding environments preferred.
• Experience with mass flow controller (MFC) calibration and integration.
• Knowledge of oxidation kinetics and surface chemistry in bonding processes.
• Familiarity with automation and control systems (PLC, sensors, feedback loops).
• Experience with cleanroom mechanical design and safety certifications.

✅Interested personnel kindly send your CV to WhatsApp: https://wa.me/65 88567364(Ethan)