Technical Fellow - Advanced Packaging & HPC Innovation

Tech Insights; Ottawa; On-site; CAD 175,000 - 195,000; Full time

Job summary

A leading semiconductor firm in Ottawa seeks a Technical Fellow to drive innovation in Advanced Packaging and HPC. The candidate will lead as a subject matter expert, shape technology roadmaps, and accelerate analysis through AI. Requires 10+ years in semiconductor packaging and a Master’s/PhD in a relevant field. The position fosters an inclusive environment and requires global travel (up to 30%). Competitive salary range is CAD 175,000 - 195,000.

Benefits

Company-sponsored training

Comprehensive benefits package

Flexible vacation policy

Bring your own device program

Community involvement opportunities

Wellness resources

Inclusive environment

Qualifications

• 10+ years of relevant industry experience in semiconductor packaging or processor design.
• Ability to connect materials and processes to system-level performance.
• Comfortable engaging with engineers and executives.

Responsibilities

• Lead as subject matter expert across advanced packaging and HPC.
• Shape and maintain technology roadmaps aligned with industry trends.
• Leverage AI tools to enhance analysis speed and accuracy.

Skills

Expertise in semiconductor packaging

Interconnect design knowledge

Processor architecture understanding

Effective communication

Collaboration skills

Familiarity with AI tools

Education

Master’s or PhD in relevant field

Tools

AI-enabled analytical tools

Job description

A leading semiconductor firm in Ottawa seeks a Technical Fellow to drive innovation in Advanced Packaging and HPC. The candidate will lead as a subject matter expert, shape technology roadmaps, and accelerate analysis through AI. Requires 10+ years in semiconductor packaging and a Master’s/PhD in a relevant field. The position fosters an inclusive environment and requires global travel (up to 30%). Competitive salary range is CAD 175,000 - 195,000.