TCB Semiconductor Packaging Design Engineer - Die Handling/Plasma Modules/N2 System - YZ11

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A leading HR consulting firm in Alberta seeks a TCB (Thermo Compression Bonding) Design Engineer. This role involves designing and optimizing TCB modules for semiconductor packaging, collaborating with various engineering teams to ensure efficiency and quality. Ideal candidates will possess a degree in an engineering field and have 2-5 years of relevant experience, including 3D/2D CAD knowledge. Competitive salary range of $6000 - $8000 monthly based on experience.

Qualifications

• Minimum 2–5 years of hands-on experience in design and development.
• Familiarity with bonding equipment and analytical tools.
• Experience with thermal system/component design.

Responsibilities

• Design and develop TCB modules assemblies.
• Collaborate with engineers for machine integration.
• Analyze test results and implement design improvements.

Skills

3D/2D CAD knowledge

Experience with TCB or Laser Assisted bonding technologies

Excellent trouble‑shooting and risk analysis

Experience in design and development of Modules

Knowledge of bonding process

Education

Bachelor’s or Master’s degree in Materials Science or Engineering

Tools

CREO Parametric

X-ray

Job description

TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development
• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
• Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing
• Oversee fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support
• Collaborate with Electrical, Vision and Software Engineers for the machine integration.
• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation
• Document all designs, simulations, and test results according to quality management and IP standards.
• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis
• Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
• Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
• Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Required Skills and Qualifications

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands‑on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Excellent trouble‑shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus.
• Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands‑on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants, WA your resume to [phone] or email your resume to [e-mail].

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279