TCB Packaging Design Engineer: Die Handling & Plasma

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A leading HR consulting firm in Alberta seeks a TCB (Thermo Compression Bonding) Design Engineer. This role involves designing and optimizing TCB modules for semiconductor packaging, collaborating with various engineering teams to ensure efficiency and quality. Ideal candidates will possess a degree in an engineering field and have 2-5 years of relevant experience, including 3D/2D CAD knowledge. Competitive salary range of $6000 - $8000 monthly based on experience.

Qualifications

• Minimum 2–5 years of hands-on experience in design and development.
• Familiarity with bonding equipment and analytical tools.
• Experience with thermal system/component design.

Responsibilities

• Design and develop TCB modules assemblies.
• Collaborate with engineers for machine integration.
• Analyze test results and implement design improvements.

Skills

3D/2D CAD knowledge

Experience with TCB or Laser Assisted bonding technologies

Excellent trouble‑shooting and risk analysis

Experience in design and development of Modules

Knowledge of bonding process

Education

Bachelor’s or Master’s degree in Materials Science or Engineering

Tools

CREO Parametric

X-ray

Job description

A leading HR consulting firm in Alberta seeks a TCB (Thermo Compression Bonding) Design Engineer. This role involves designing and optimizing TCB modules for semiconductor packaging, collaborating with various engineering teams to ensure efficiency and quality. Ideal candidates will possess a degree in an engineering field and have 2-5 years of relevant experience, including 3D/2D CAD knowledge. Competitive salary range of $6000 - $8000 monthly based on experience.