TCB Design Engineer [ Thermo Compression Bonding | Thin/Large die handling modules |Plasma Modu[...]

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A leading HR advisory firm in Alberta seeks a TCB Design Engineer to optimize mechanical designs for Thermo-Compression Bonding equipment used in semiconductor packaging. Candidates should possess a degree in Engineering, 2-5 years of experience in precision equipment design, and strong CAD tool proficiency. The role requires teamwork and hands-on experience with advanced packaging methods, offering a competitive salary.

Qualifications

• 2–5 years of direct experience in precision equipment design, ideally for semiconductor packaging.
• Strong knowledge in TCB, Laser-Assisted Bonding, or assembly technologies.
• Familiarity with bonding and inspection tools like X-ray and optical microscopy.

Responsibilities

• Design and develop mechanical modules for Thermocompression Bonders.
• Evaluate material selections for thermal and mechanical performance.
• Collaborate with process engineering to optimize designs for bonding quality.

Skills

Precision equipment design

Thermocompression Bonding (TCB)

3D CAD tools (SolidWorks, Creo, NX)

Mechanical simulation tools

Cross-disciplinary teamwork

Education

Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field

Tools

SolidWorks

Creo

NX

Job description

Position title : TCB Design Engineer (Thermo Compression Bonding)

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Mechanical Design and Development

• Design and develop mechanical modules for Thermocompression Bonders used in chip-to-wafer and chip-to-substrate bonding applications.
• Create and maintain detailed 3D and 2D CAD models, perform tolerance stack-up analyses, and prepare complete BOMs.
• Design precision subsystems such as bond heads, bond stages, thin/large die handling modules, plasma cleaning units, N₂ purge systems, and cleanroom Class 100 assemblies.
• Evaluate material and component selections for thermal, mechanical, and vacuum performance.

Project Planning and Execution

• Define project scope, deliverables, and timelines for assigned modules.
• Support planning, scheduling, and cost estimation for mechanical subassemblies.
• Work closely with electrical, software, and vision teams for system-level integration.
• Participate in prototype build, machine debug, and verification activities.
• Provide on-site engineering support during system installation, customer buy-off, and troubleshooting.

Process and Technology Integration

• Collaborate with process engineering to optimize mechanical designs for bonding quality, alignment accuracy, and thermal uniformity.
• Contribute to improvements in temperature control, pressure regulation, and force calibration within the bonding process.
• Support technology transfer from R&D to production, including documentation and training.
• Apply statistical process control (SPC) and inline monitoring techniques to ensure repeatability and yield consistency.

Compliance and Safety

• Ensure designs meet internal standards for mechanical safety, cleanroom compatibility, and ergonomic considerations.
• Adhere to environmental, health, and safety (EHS) policies during design, assembly, and testing activities.
• Participate in design reviews and risk assessments to verify design robustness and maintainability.

Requirements

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
• 2–5 years of direct experience in precision equipment design, preferably for semiconductor packaging, die attach, or advanced interconnect processes.
• Strong knowledge of Thermocompression Bonding (TCB), Laser-Assisted Bonding, or related assembly technologies.
• Proficiency in 3D CAD tools (e.g., SolidWorks, Creo, NX) and mechanical simulation tools for stress, thermal, or modal analysis.
• Familiarity with bonding and inspection tools such as X-ray, SAM, and optical microscopy.
• Understanding of materials behavior under thermal/mechanical stress, including CTE mismatch, adhesive curing, and flux management.
• Ability to work in cross-disciplinary teams and support parallel development programs under tight schedules.
• Hands‑on experience with HBM, CoWoS, 2.5D packaging, or fluxless bonding is a strong advantage.

Interested Personal kindly contact WhatsApp :[phone](Lydia)

OR

Email to : [e-mail]

The Supreme HR Advisory Pte Ltd

Reg No: R1988890

EA No: 14C7279