TCB Design Engineer – Die Ejection Systems (Thin Die & CoW Packages) - YZ11

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A leading engineering advisory firm in Alberta is seeking a TCB Design Engineer with expertise in die ejection systems for semiconductor packaging. You will lead design efforts requiring knowledge of mechanical stress analysis and sophisticated CAD tools. Ideal candidates should have over 5 years of experience in semiconductor equipment design, demonstrating familiarity with CoWoS processes and precision tooling design. Competitive salary and dynamic work environment offered.

Qualifications

• 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
• Strong background in mechanical stress analysis and warpage modeling.
• Prior involvement in CoWoS, 2.5D, or HBM packaging processes.

Responsibilities

• Lead the design of die ejection modules capable of handling ultra‑thin dies.
• Develop mechanical tooling to minimize stress and die cracking during ejection.
• Collaborate with cross‑functional teams to optimize ejection solutions.

Skills

Mechanical stress analysis

Warpage modeling

Precision tooling design

3D CAD software proficiency

FEA tools experience

Tape residue management

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

SolidWorks

Creo

ANSYS

COMSOL

Job description

Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)

Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview

We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands‑on experience in ejecting ultra‑thin dies (down to 25 µm) from wafers and familiarity with Chip‑on‑Wafer (CoW) package handling for CoWoS assembly. This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage.

Key Responsibilities

• Lead the design of die ejection modules capable of handling ultra‑thin dies (≤ 25 µm).
• Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.
• Incorporate simulation‑based validation (FEA) for warpage, stress, and deformation analysis.
• Design ejection solutions that effectively mitigate residue‑related yield loss from wafer dicing tape.
• Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick‑up.
• Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput.
• Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications.
• Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection.
• Analyze yield loss due to ejection‑related defects and implement design or process improvements.
• Support cross‑functional teams in root‑cause analysis and failure prevention.

Requirements

• Bachelor’s or Master’s degree in Mechanical Engineering, Mechatronics, or related field.
• 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
• Strong background in mechanical stress analysis, warpage modeling, and precision tooling design.
• Proficiency with SolidWorks, Creo, or equivalent 3D CAD software.
• Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis.
• Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages.
• Prior involvement in CoWoS, 2.5D, or HBM packaging processes.
• Hands‑on experience with tape residue management, die pick‑up optimization, or die attach automation.
• Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques.
• Experience collaborating with process, electrical, and software teams in semiconductor tool development.

Interested applicants, WA your resume to [phone] or email your resume to [e-mail].

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279