TCB Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) - SM09

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A recruitment agency specialized in engineering positions is seeking a Mechanical Design Engineer to lead the design of die ejection systems for semiconductor packaging. The role requires expertise in mechanical stress analysis and precision tooling design, with a focus on ultra-thin dies and CoWoS packages. Candidates should have at least 5 years of experience in semiconductor equipment design and proficiency with FEA tools and CAD software.

Qualifications

• 5+ years of experience in semiconductor equipment design.
• Strong background in mechanical stress analysis and precision tooling design.
• Hands-on experience with tape residue management and die pick-up optimization.

Responsibilities

• Lead the design of die ejection modules for ultra-thin dies.
• Develop mechanical tooling to minimize stress and die damage.
• Collaborate with engineering teams to optimize ejection parameters.

Skills

Mechanical stress analysis

Precision tooling design

SolidWorks

FEA tools

Die handling experience

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

SolidWorks

ANSYS

COMSOL

Job description

TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)

Location:Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands-on experience in ejecting ultra-thin dies (down to 25 µm) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly. This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage.

Key Responsibilities

• Lead the design of die ejection modules capable of handling ultra-thin dies (≤ 25 µm).
• Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.
• Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis.
• Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape.
• Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick-up.
• Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput.
• Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications.
• Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection.
• Analyze yield loss due to ejection-related defects and implement design or process improvements.
• Support cross-functional teams in root-cause analysis and failure prevention.

Requirements

• Bachelor’s or Master’s degree in Mechanical Engineering, Mechatronics, or related field.
• 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
• Strong background in mechanical stress analysis, warpage modeling, and precision tooling design.
• Proficiency with SolidWorks, Creo, or equivalent 3D CAD software.
• Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis.
• Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages.
• Prior involvement in CoWoS, 2.5D, or HBM packaging processes.
• Hands-on experience with tape residue management, die pick-up optimization, or die attach automation.
• Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques.
• Experience collaborating with process, electrical, and software teams in semiconductor tool development.