Systems Intern - Validation, Software, Design, Architecture & Packaging (Canada)

Tenstorrent; Vancouver; On-site; CAD 60,000 - 90,000; Full time

Job summary

Tenstorrent is seeking motivated students for on-site roles in Toronto or Vancouver. You will contribute to post-silicon validation and system software while engaging in packaging, power, thermal, and IO work alongside world-class engineers.

You are pursuing a BS, MS, or PhD in EE, computer engineering, CS, or mechanical engineering with coursework in embedded systems, board-level design, or thermal management using C/C++, Python, CAD, or Verilog.

Qualifications

• Pursuing BS/MS/PhD in EE, computer engineering, CS, or mechanical engineering.
• Coursework or projects in embedded systems, microwave and signal integrity, board-level design, or thermal/mechanical engineering.
• Proficiency in low-level programming (C/C++) or hardware design and simulation tools.

Responsibilities

• Assist in post-silicon testing of physical microchips under real-world workloads.
• Contribute to developing foundational software including firmware, drivers, and OS interfaces.
• Help map and evaluate high-level hardware frameworks and optimize power delivery and high-speed performance.
• Participate in packaging, SI/PI, mechanical design, and stress analysis.

Skills

Embedded systems

Microwave & signal integrity

Board-level design

Thermal/Mechanical engineering

C/C++

Python

Hardware design

Education

BS/MS/PhD in EE, Computer Engineering, CS or Mechanical Engineering

Tools

CAD

FEA

Verilog

Job description

Overview:

A chip isn't a product until it's a working system. These teams cover both ends of that: getting silicon to boot and validate correctly, building the board, power, mechanical, thermal, packaging and IO around it. You submit one application, you have one recruiter screen - then we match you to the specific team below and location that fits best.

• Systems & Silicon Validation: Post-silicon testing of physical chips and integrated systems to ensure they meet all functional, electrical, and performance specs.
• System Software: Development of foundational software, including firmware, drivers, and operating systems, that directly controls and interfaces with hardware.
• System Design: The process of defining, integrating, and mapping out hardware components such as PCBs, software modules, and interfaces into a complete product blueprint.
• System Architecture: Define the high-level structural framework, interfaces, and data-flow pathways between the CPU, memory, and peripherals.
• Packaging: A package is what is placed between the silicon and the board; and its design requires detailed electrical, electromagnetic, and mechanical simulations and analysis.

This role is on-site based out of Toronto, Ontario or Vancouver, British Columbia.

Who You Are

• Currently pursuing a BS, MS, or PhD in EE, Computer Engineering, Computer Science or Mechanical Engineering
• Coursework or projects in embedded systems, microwave and signal integrity, board-level design, or thermal/mechanical engineering using low-level programming (C/C++, Python) or hardware design and/or simulation tools (e.g., CAD, FEA, Verilog).
• Problem solver with strong foundational knowledge in one of these areas: electrical engineering, digital logic, computer architecture, or thermal/mechanical.
• Curious learner who is passionate about the intersection of software, silicon architecture, and the physical constraints of chip packaging and printed circuit boards (PCBs).

What We Need

• Systems & Silicon Validation: Assist in post-silicon testing of physical microchips under real-world workloads to ensure they meet all functional, electrical, and performance specifications.
• System Software: Contribute to developing foundational software—including firmware, drivers, and operating systems—that directly controls and interfaces with the semiconductor hardware.
• System Design & Architecture: Help map out, define, and evaluate high-level structural frameworks, optimizing the power delivery and high-speed performance benchmarks of both the silicon components and the underlying PCBs.
• Semiconductor Packaging & Mechanical Design: Design and layout, Electromagnetic (signal integrity and power integrity), mechanical design, and stress analysis

What You Will Learn

• Hands-on silicon experience using industry-standard lab equipment to bridge the gap between theoretical hardware design, physical packaging layouts, and real-world chips.
• Low-level software development by writing production-grade firmware, device drivers, and diagnostic tools that run directly on bare metal.
• Mechanical & thermal engineering for electronics by learning how structural stress, heat dissipation, thermal expansion, and mechanical shock affect the structural integrity and performance of PCBs and packages.
• Cross-functional collaboration working alongside world-class architects, mechanical designers, package engineers, and software teams to understand how complex, large-scale chip ecosystems are built from scratch.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.