Senior Microelectronic Packaging Engineer

Sanmina-SCI Systems de México; Ottawa; On-site; CAD 85,000 - 120,000; Full time

Job summary

A leading company in the technology sector is seeking a Microelectronic Packaging Design Engineer to join their innovative team. You will work on cutting-edge microelectronics projects involving design and product development from concept to manufacturing. The ideal candidate will hold a Bachelor’s degree and have significant experience in the field, particularly in packaging for RF and optical applications.

Qualifications

• 5+ years of relevant experience in electronic hardware design.
• Experience in Wafer Level Packaging and Chip Scale Packaging.
• Proficient in computer aided design tools.

Responsibilities

• Design microelectronic modules and components.
• Generate product documentation including specifications and drawings.
• Support business development and customer interfacing.

Skills

Communication

Teamwork

Education

Bachelor’s Degree in Mechanical Engineering

Relevant Degree in Physics

Tools

AutoCad

SolidWorks

Cadence Allegro Package Designer Plus

Job description

A leading company in the technology sector is seeking a Microelectronic Packaging Design Engineer to join their innovative team. You will work on cutting-edge microelectronics projects involving design and product development from concept to manufacturing. The ideal candidate will hold a Bachelor’s degree and have significant experience in the field, particularly in packaging for RF and optical applications.