Senior Engineer - Thermo-Mechanical Simulation (Semiconductor Packaging) [2.5D / 3D IC / Chiple[...]

The Supreme HR Advisory; Alberta; On-site; CAD 100,000 - 125,000; Full time

Job summary

An advanced technology consulting firm is seeking a Senior Engineer specializing in thermo-mechanical simulation for semiconductor packaging. The role entails developing finite element models for package warpage prediction and ensuring thermal and mechanical performance across next-generation products. Close collaboration with engineering teams is essential. Competitive salary between $4000 - $8000 is based on experience.

Qualifications

• Specialization in thermo-mechanical simulation and analysis for semiconductor packaging.
• Experience in developing detailed finite element models for warpage prediction.
• Ability to analyze thermal flow and heat distribution during bonding processes.

Responsibilities

• Develop and execute detailed finite element models to predict package warpage.
• Perform thermo-mechanical stress and strain analysis on large packages.
• Optimize thermal processes and interactions during assembly.

Skills

Thermo-mechanical simulation

Finite element analysis (FEA)

Thermal behavior analysis

Package warpage prediction

Job description

Senior Engineer - Thermo-Mechanical Simulation (Semiconductor Packaging)

Location: Admiralty

Working Days: 5 Day A Week

Working hours: 9:00am - 6:00pm

Salary: $4000 - $8000 (depends experience)

Overview

We are seeking an engineer to join our advanced semiconductor packaging team. The candidate should specialize in thermo-mechanical simulation and analysis for advanced package architectures, with a focus on warpage prediction of large packages and thermal behaviour during Thermocompression (TC) bonding. This role will involve close collaboration with cross‑functional teams in package, process engineering, and reliability to ensure robust thermal and mechanical performance across next‑generation semiconductor products.

Key Responsibilities

Thermo-Mechanical Simulation & Modelling

• Develop and execute detailed finite element (FEA) models to predict package warpage during assembly, reflow, and operation.
• Perform thermo‑mechanical stress and strain analysis to assess package integrity, focusing on large and heterogeneous packages (e.g., 2.5D/3D IC, chiplets, and large interposers).
• Model and analyze thermal flow and heat distribution within the package during Thermocompression bonding and other thermal processes.

Thermal Flow & Process Interaction

• Simulate and optimize thermal