Senior Electro-Optic Systems Architect - Photonics

Lightmatter; Toronto; Hybrid; CAD 150,000 - 190,000; Full time

Benefits offered by this job

Health care

Retirement matching

Life Insurance

Paid time off

Family leave

Disability insurance

Training & development

Commuter benefits

Hybrid workplace

Equity grants

Job summary

Lightmatter is advancing AI data center photonics. We are hiring an Electro-Optic Systems Architect to design, model, and test high-speed electro-optic links for Passage™.

You will work with cross-disciplinary teams to ensure end-to-end system performance, leveraging Cadence tools and silicon photonics expertise. The role requires deep knowledge of CMOS, silicon photonics, 40+ GHz interconnects, and 3D integration.

Qualifications

• PhD or MS in Electrical Engineering with extensive relevant experience.
• Minimum 5 years in electronic-photonic-electronic systems simulation.
• Experience with hardware testing of photonic high-speed modulators/receivers.

Responsibilities

• Model electro-optic architecture to meet customer requirements.
• Co-design silicon photonic devices with photonics and design teams.
• Validate models with high-speed RF experiments and concept tests.
• Collaborate with electronics and photonics engineers to meet performance targets.
• Document and present results to stakeholders.

Skills

RF/mm-wave analog design

Optical link modeling

Electro-optic system simulation

Python/ Matlab coding

Hardware testing

Education

PhD in Electrical Engineering

MS in Electrical Engineering

Tools

Cadence photonics-analog simulators

Ansys HFSS

Keysight ADS

Python/ Matlab

Job description

Lightmatter is advancing AI data center photonics. We are hiring an Electro-Optic Systems Architect to design, model, and test high-speed electro-optic links for Passage™.

You will work with cross-disciplinary teams to ensure end-to-end system performance, leveraging Cadence tools and silicon photonics expertise. The role requires deep knowledge of CMOS, silicon photonics, 40+ GHz interconnects, and 3D integration.