MTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)

GlobalFoundries; Alberta; On-site; CAD 80,000 - 110,000; Full time

Job summary

A leading semiconductor foundry in Canada is seeking an experienced 3D Heterogeneous Integration R&D Engineer to drive thermal solutions for next-generation hybrid bonding development. This role involves leading efforts for establishing advanced packaging solutions and requires a Master’s degree in a relevant field with at least 5 years of experience. Strong communication and leadership skills are essential.

Qualifications

• Master’s in Electrical, Mechanical, Chemical Engineering, or Materials Science.
• At least 5 years of related work experience required.
• English fluency in written and verbal communication.

Responsibilities

• Lead thermal solutions for advanced packaging.
• Drive process integration and planning.
• Collaborate with vendors to develop new processes.

Skills

Leadership

Project management

Strong communication

Planning and organizational skills

Education

Master’s degree in relevant field

PhD preferred

Job description

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive thermal solutions for next-generation hybrid bonding development.

Essential Responsibilities:

• Lead 3DHI process development efforts for establishing thermal solutions required for advanced packaging solutions needed in the product lines (e.g., multi-die stacking, fine pitch hybrid bonding, etc.) and planning by working with the unit process engineers, manufacturing engineers, as well as directly with the tools & materials for the GF Singapore semiconductor fabs.
• Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
• Develop expertise in the processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
• Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3DHI processes.
• Drive understanding of failure modes.
• Facilitate advanced packaging interactions between the GF Singapore Product Line/Fab teams and customers.
• Generate IP related to novel wafer integration & packaging technology.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Take part in hiring of other Advanced Packaging team members in Singapore.
• Mentor and guide new hires to assume their roles and responsibilities.
• Other duties as assigned by manager.

Required Qualifications:

• Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• MS degree with at least 5 years of prior related work experience.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 20%.

Preferred Qualifications:

• Education – PhD education level preferred with at least 8 years of prior related work experience.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning & organizational skills.