Laser-Assisted Bonder — Advanced Packaging Process Engineer

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A premier HR advisory firm in Canada, Alberta is searching for a Laser-Assisted Bonder (LAB) Process Engineer. You will develop and optimize laser bonding processes for chip packaging, ensuring high precision and reliability. The ideal candidate should possess a relevant degree and has 2-5 years of experience in semiconductor packaging processes. This position offers a competitive salary and seeks candidates with strong analytical skills and familiarity with laser technologies.

Qualifications

• Minimum 2–5 years of hands-on experience in equipment design or semiconductor packaging.
• Experience with bonding technologies preferred; familiarity with laser or optical systems required.
• Knowledge of bonding process behavior under thermal/mechanical stress.

Responsibilities

• Develop and optimize laser-assisted bonding processes for product packaging.
• Qualify new processes from R&D to high-volume production.
• Collaborate with R&D, operations, and quality teams for process implementation.

Skills

Laser Assisted bonding technologies

Troubleshooting

Risk analysis

Statistical analysis (JMP, Minitab)

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field

Tools

X-ray

SAM

OM

Job description

A premier HR advisory firm in Canada, Alberta is searching for a Laser-Assisted Bonder (LAB) Process Engineer. You will develop and optimize laser bonding processes for chip packaging, ensuring high precision and reliability. The ideal candidate should possess a relevant degree and has 2-5 years of experience in semiconductor packaging processes. This position offers a competitive salary and seeks candidates with strong analytical skills and familiarity with laser technologies.