L.A.B Process Engineer – Semiconductor Advanced Chip Packaging - YZ11

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A specialized recruitment firm is seeking a Laser-Assisted Bonder (LAB) Process Engineer to develop and optimize bonding processes for semiconductor packaging. The ideal candidate holds a degree in Materials Science or Engineering and has 2–5 years of experience. Responsibilities include cross-functional collaboration, troubleshooting, and ensuring safety compliance. This full-time role offers a competitive salary based on experience.

Qualifications

• 2–5 years of hands-on experience in equipment or semiconductor packaging.
• Experience with Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools like X-ray and OM.

Responsibilities

• Develop and optimize laser-assisted bonding processes for product packaging.
• Qualify new laser bonding processes from R&D to production.
• Troubleshoot laser systems and bonding processes.

Skills

Troubleshooting

Process optimization

Statistical analysis

Cross-functional collaboration

Education

Bachelor’s or Master’s degree in Materials Science or Engineering

Tools

SPC

Six Sigma

JMP

Minitab

Job description

Laser-Assisted Bonder (LAB) Process Engineer

Location: Admiralty

Working Days: 5 days a week

Working hours: 9:00am - 6:00pm

Salary: $6000 - $8000 (depends on experience)

Overview

A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip‑to‑Wafer or Chip‑to‑Substrate bonding.

Key Responsibilities

• Process Development & Optimization: Develop, implement, and optimize laser‑assisted bonding processes for product packaging, advanced interconnects, or micro‑assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
• Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high‑volume production, working with both development and production teams.
• Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
• Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
• Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost using data‑driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
• Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
• Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
• Safety & Compliance: Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
• Customer & Project Support: Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed.
• Laser Maintenance & Calibration (Good-to-have): Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root‑cause analysis for equipment issues.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands‑on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes.
• Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.
• Familiarity with bonding equipment and analytical tools (X‑ray, SAM, OM, etc.).
• Familiarity with advanced process control and manufacturing best practices.
• Excellent troubleshooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behavior under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus.

Interested applicants, WA your resume to [phone] or email your resume to [e-mail].