Embedded Software Intern for AI-Driven Networking

Ciena

Ottawa

On-site

CAD 35,000 - 48,000

Full time

11 days ago

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Benefits offered by this job

Employee Assistance Program (EAP)
Company-paid holidays
Paid sick leave
Vacation pay

Job summary

Ciena, a global leader in high-speed connectivity, offers a co-op/intern opportunity in embedded software. You will contribute to coding assignments, create tests, and work within an Agile team to develop and validate software for flagship networking products.

You will learn real-time embedded systems, participate in code reviews, and gain hands-on experience in modern development workflows while collaborating with experienced engineers during a 4‑month Winter 2027 term in Ottawa, Canada.

Qualifications

  • Actively enrolled in a degree program in Engineering or Computer Science.
  • Foundational coding concepts and programming structures.
  • Ability to work independently and in a team.
  • Willingness to learn new technologies and tools.
  • Embrace AI tools across the software lifecycle.

Responsibilities

  • Contribute to coding assignments for embedded platform and application software.
  • Create and execute tests to validate new capabilities.
  • Collaborate with the team following Agile practices.
  • Participate in code reviews and apply feedback.
  • Troubleshoot and resolve software issues.
  • Learn modern development workflows and tools.
  • Gain hands-on experience with real-time embedded systems.

Skills

C
C++
Python
Git
Agile
Embedded software
Teamwork
Curiosity

Education

Engineering or Computer Science degree program

Tools

Git
Bitbucket
Gerrit
Jira

Job description

Ciena, a global leader in high-speed connectivity, offers a co-op/intern opportunity in embedded software. You will contribute to coding assignments, create tests, and work within an Agile team to develop and validate software for flagship networking products.

You will learn real-time embedded systems, participate in code reviews, and gain hands-on experience in modern development workflows while collaborating with experienced engineers during a 4‑month Winter 2027 term in Ottawa, Canada.

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