Die Ejection Systems Engineer for CoW/CoWoS (≤25µm)

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A recruitment agency specialized in engineering positions is seeking a Mechanical Design Engineer to lead the design of die ejection systems for semiconductor packaging. The role requires expertise in mechanical stress analysis and precision tooling design, with a focus on ultra-thin dies and CoWoS packages. Candidates should have at least 5 years of experience in semiconductor equipment design and proficiency with FEA tools and CAD software.

Qualifications

• 5+ years of experience in semiconductor equipment design.
• Strong background in mechanical stress analysis and precision tooling design.
• Hands-on experience with tape residue management and die pick-up optimization.

Responsibilities

• Lead the design of die ejection modules for ultra-thin dies.
• Develop mechanical tooling to minimize stress and die damage.
• Collaborate with engineering teams to optimize ejection parameters.

Skills

Mechanical stress analysis

Precision tooling design

SolidWorks

FEA tools

Die handling experience

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

SolidWorks

ANSYS

COMSOL

Job description

A recruitment agency specialized in engineering positions is seeking a Mechanical Design Engineer to lead the design of die ejection systems for semiconductor packaging. The role requires expertise in mechanical stress analysis and precision tooling design, with a focus on ultra-thin dies and CoWoS packages. Candidates should have at least 5 years of experience in semiconductor equipment design and proficiency with FEA tools and CAD software.