Die Ejection Engineer for Ultra-Thin 25µm Dies (CoWoS)

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A leading engineering advisory firm in Alberta is seeking a TCB Design Engineer with expertise in die ejection systems for semiconductor packaging. You will lead design efforts requiring knowledge of mechanical stress analysis and sophisticated CAD tools. Ideal candidates should have over 5 years of experience in semiconductor equipment design, demonstrating familiarity with CoWoS processes and precision tooling design. Competitive salary and dynamic work environment offered.

Qualifications

• 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
• Strong background in mechanical stress analysis and warpage modeling.
• Prior involvement in CoWoS, 2.5D, or HBM packaging processes.

Responsibilities

• Lead the design of die ejection modules capable of handling ultra‑thin dies.
• Develop mechanical tooling to minimize stress and die cracking during ejection.
• Collaborate with cross‑functional teams to optimize ejection solutions.

Skills

Mechanical stress analysis

Warpage modeling

Precision tooling design

3D CAD software proficiency

FEA tools experience

Tape residue management

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

SolidWorks

Creo

ANSYS

COMSOL

Job description

A leading engineering advisory firm in Alberta is seeking a TCB Design Engineer with expertise in die ejection systems for semiconductor packaging. You will lead design efforts requiring knowledge of mechanical stress analysis and sophisticated CAD tools. Ideal candidates should have over 5 years of experience in semiconductor equipment design, demonstrating familiarity with CoWoS processes and precision tooling design. Competitive salary and dynamic work environment offered.