Design Engineer (Die Ejection Systems) | TCB (Thermo Compression Bonding) | Thin Die & CoW Pack[...]

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A leading HR consultancy in Canada seeks a Mechanical Design Engineer specializing in die ejection systems for semiconductor packaging equipment. The ideal candidate will have 5+ years of experience and a strong background in mechanical stress analysis and precision tooling design. You will lead the design of innovative ejection modules while collaborating with cross-functional teams to improve efficiency and yield. Salary ranges from $6000 to $8000 depending on experience.

Qualifications

• 5+ years of experience in semiconductor equipment design.
• Strong background in mechanical stress analysis.
• Hands-on experience with tape residue management.

Responsibilities

• Lead the design of die ejection modules for ultra-thin dies.
• Develop mechanical tooling to minimize stress during ejection.
• Collaborate with engineers to optimize ejection force and throughput.

Skills

Mechanical stress analysis

Warpage modeling

Precision tooling design

Simulation-based validation

Collaboration with cross-functional teams

Education

Bachelor's or Master's degree in Mechanical Engineering

Tools

SolidWorks

FEA tools (ANSYS, COMSOL)

Creo

Job description

TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)

Location: 8 Admiralty Stree

Working Days: 5 Day A Week

Working hours: 9:00am - 6:00pm

Salary: $6000 - $8000 (depends experience)

Role Overview

We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands-on experience in ejecting ultra-thin dies (down to 25 µm) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly. This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage.

Key Responsibilities

• Lead the design of die ejection modules capable of handling ultra-thin dies (≤ 25 µm).
• Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.
• Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis.
• Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape.
• Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick-up.
• Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput.
• Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications.
• Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection.
• Analyze yield loss due to ejection-related defects and implement design or process improvements.
• Support cross-functional teams in root-cause analysis and failure prevention.

Requirements

• Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or related field.
• 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
• Strong background in mechanical stress analysis, warpage modeling, and precision tooling design.
• Proficiency with SolidWorks, Creo, or equivalent 3D CAD software.
• Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis.
• Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages.
• Prior involvement in CoWoS, 2.5D, or HBM packaging processes.
• Hands-on experience with tape residue management, die pick-up optimization, or die attach automation.
• Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques.
• Experience collaborating with process, electrical, and software teams in semiconductor tool development.