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Synopsys Inc. is seeking an experienced ASIC Physical Design Engineer to drive the implementation of test chips across DDR/HBM/UCIe protocols, from RTL to GDS release.
You will shape floorplans, power/ground strategies, and own the RTL-to-GDSII flow, working with architecture, RTL, circuit, and covercell teams to ensure timing, area, power, and manufacturability targets. You will lead complex, cross-functional projects, coordinate test chip methodologies, and contribute to flow automation and
At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.
At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.
You are an experienced ASIC Physical Design Engineer with a passion for innovation and a proven track record in complex SoC and test chip implementations. You thrive in collaborative environments, excel at cross-functional teamwork, and are ready to lead technical execution on advanced process nodes. Your expertise in the physical design flow and familiarity with industry-leading tools make you a valuable contributor to our mission of delivering robust, silicon-proven IP solutions.
You'll join the Test Chip PHY development team within Synopsys's Silicon IP business. This group is dedicated to integrating and validating Synopsys's broad portfolio of IP blocks-logic, memory, interfaces, analog, security, and embedded processors-into test chips at the forefront of semiconductor innovation. The team works collaboratively across architecture, RTL, circuit, and covercell disciplines to deliver robust, silicon-proven IP solutions that power next-generation products for global customers.
We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings.