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Amazon Leo is seeking a Senior Aerospace Hardware Development Engineer to lead the solar array hardware design for next‑generation LEO spacecraft, from concept through qualification.
You will own modules, deployable wings, and interfaces, drive materials selection, CAD artifacts, and qualification campaigns, collaborating with power, structures, thermal, and manufacturing teams in a fast‑paced environment.
Amazon Leo is Amazon's low Earth orbit satellite network. Our mission is to deliver fast, reliable internet connectivity to customers beyond the reach of existing networks. From individual households to schools, hospitals, businesses, and government agencies, Amazon Leo will serve people and organizations operating in locations without reliable connectivity.
We are seeking a Sr. Aerospace Hardware Development Engineer to join the Solar Design Team. In this role, you will lead the design, development, and qualification of solar array hardware for next-generation LEO constellation spacecraft. You will own solar array hardware development across the array portfolio, which includes solar power modules, deployable wing structures, secondary structures, and array-level mechanical interfaces. You will be expected to operate broadly across this hardware and step into ownership of critical subsystems as the team scales.
The ideal candidate is a strong mechanical or aerospace engineer with experience in solar array hardware, deployable structures, or lightweight aerospace assemblies. Experience with composites, adhesive bonding, thin-film polymers, or flexible substrate technologies is highly valued, as the team is actively developing next-generation lightweight array concepts. You are comfortable taking ambiguous hardware problems from requirements definition through qualification, and you maintain a hands-on connection to your hardware throughout the development cycle.
Export Control Requirement: Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
You will operate with significant autonomy, owning the development of array hardware subsystems end-to-end. Your time will split between design and analysis, collaboration with cross-functional partners, and hands‑on work in the lab with your hardware. The ideal candidate is self‑motivated and comfortable making engineering decisions in a fast‑paced environment where priorities and focus areas evolve with program needs.
The Solar Design team owns the design, qualification, and technology development of the satellite solar array assembly, including solar power modules, secondary structures (wings, frames, blankets), and array‑level interfaces and deployment mechanisms. The team supports multiple concurrent programs from production support through next‑generation development and advanced R&D. You will work within the Mechanical Engineering organization and collaborate broadly with Power Systems, Structures, Thermal, Mechanisms, Manufacturing, and Mission Operations teams.
Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent, or experience working in Science, Technology, Engineering, or Mathematics (STEM)
5+ years of experience in hardware development (aerospace, automotive, defense, motorsport, or similarly demanding industries), with demonstrated experience leading design, analysis, and qualification of hardware.
Experience with lightweight structures, deployable systems, or precision mechanical assemblies in a performance‑critical environment.
Experience driving hardware from concept through build, test, and qualification.
Hands‑on experience with prototype fabrication, hardware builds, or laboratory testing.
Master's degree in Mechanical Engineering, Aerospace Engineering, Materials Science, or related field.
Direct experience with satellite solar array or photovoltaic module hardware development.
Experience with flexible or roll‑out solar array technologies, including lightweight substrates, blanket architectures, or deployable structural concepts.
Experience with materials and process development for aerospace structures: adhesive bonding, composite laminates, polymer films, or thin‑film encapsulants.
Experience transitioning hardware designs from development into volume manufacturing.
Experience with structural FEA (Ansys, NASTRAN, or equivalent) or thermal analysis for lightweight structures.
Strong communication skills with the ability to present technical trade‑offs to cross‑functional teams and leadership.
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign‑on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits .
USA, WA, Redmond - 159,200.00 - 215,300.00 USD annually