Senior Technical Program Lead Semiconductors & Packaging

Syenta; Sydney; On-site; AUD 140,000 - 180,000; Full time

Benefits offered by this job

Salary Range details

Early-stage equity opportunities

12% superannuation

Flexible leave policies

Professional growth

Team events in Australia

Job summary

Syenta is seeking a high‑ownership Program Manager to directly lead and execute critical company projects, owning the end‑to‑end lifecycle under tight deadlines. You will align multiple international departments to ensure seamless execution and proactively mitigate risks in a dynamic startup environment.

The role requires experience managing complex technical programs in semiconductor contexts, strong cross‑functional leadership, and the ability to translate data into actionable improvements for

Qualifications

• 10+ years managing complex technical programs in hardware or semiconductor contexts.
• Formal PM education; PMP or Scrum Master certification preferred.
• Experience coordinating with external fabs/foundries and suppliers.

Responsibilities

• Owns end-to-end project lifecycle and drives execution against tight, technical deadlines.
• Applies PM principles across small to large programs.
• Aligns international departments to ensure seamless execution.
• Manages supplier and fab relationships to meet milestones.
• Collects data and reports program performance dashboards.

Skills

Program management

Semiconductor packaging

External fab coordination

Cross-functional leadership

Executive stakeholder reporting

PM education PMP/Scrum

Startup experience

Risk management

Process/fabrication fluency

Education

PM certification (PMP/Scrum Master)

Job description

Syenta is seeking a high‑ownership Program Manager to directly lead and execute critical company projects, owning the end‑to‑end lifecycle under tight deadlines. You will align multiple international departments to ensure seamless execution and proactively mitigate risks in a dynamic startup environment.

The role requires experience managing complex technical programs in semiconductor contexts, strong cross‑functional leadership, and the ability to translate data into actionable improvements for