Senior Modem ATE Test Engineer , Amazon Leo

Amazon Inc.

Redmond

On-site

AUD 264,000 - 356,000

Full time

14 days+

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Job summary

Amazon Leo seeks a Senior Modem ATE Test Engineer to own digital ATE test development end-to-end on Advantest 93K and Teradyne UltraFLEX platforms. You will lead test pattern development, MBIST, and high-speed SERDES testing, interfacing with ASIC design, DFT, and manufacturing teams to ensure testability and cost-efficient high-volume production.

You will bring up new devices, characterize performance, and drive shmoo characterization to establish robust production limits while reducing test

Qualifications

  • Bachelor's degree in electrical/computer engineering or equivalent.
  • 7+ years of digital ATE test development experience, preferably in high-volume manufacturing.
  • Experience testing complex SoCs and modem/wireless devices in advanced nodes (7nm and below).
  • Experience developing and debugging test programs on Advantest 93K and/or Teradyne UltraFLEX platforms.
  • Familiarity with JTAG/boundary-scan and DFT/DFM principles.
  • Proficiency in digital test methodologies: scan/ATPG, MBIST, Vmin, loopback.
  • Proficiency in high-speed SERDES test at 100G+, including equalization and jitter analysis.
  • Experience with wafer sort/final test hardware bring-up and debugging.

Responsibilities

  • Develop, debug, and release digital test programs for ASIC/SoC and modem devices on Advantest 93K and Teradyne UltraFLEX.
  • Build and debug scan/ATPG test content for complex devices.
  • Implement MBIST and memory repair flows.
  • Characterize silicon performance and variation via ring oscillator and process monitor tests.
  • Test and debug interfaces such as I3C, SPI, and GPIO.
  • Optimize high-speed SERDES/HSIO test including jitter and eye analysis.
  • Translate DFT test patterns to tester formats and validate on hardware.
  • Bring up new devices and define test conditions for robust production limits.
  • Lead device correlation between wafer sort and final test; reduce test time and cost.
  • Design FT and WT hardware with signal integrity in mind; collaborate with design/DFT teams.
  • Analyze production data to drive yield, quality, and test efficiency improvements.
  • Identify readiness gaps and drive resolution throughout product lifecycle.
  • Support qualification activities like HTOL and ESD; mentor junior engineers.

Skills

Digital ATE test development
7+ years experience
Advantest 93K
Teradyne UltraFLEX
JTAG boundary-scan
DFT/DFM
100G+ SERDES test
Python
Perl
Tcl/Tk

Education

Bachelor's degree in Electrical/Computer Engineering
Master's degree in Electrical/Computer Engineering

Tools

Advantest 93K
Teradyne UltraFLEX
STIL/WGL formats

Job description

Description

Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.

Come work at Amazon!

The Role

As a Senior Modem ATE Test Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions for custom silicon powering the Leo network. You will lead the development of high-volume production test methodology for complex SoCs and modem devices, working closely with internal inter-disciplinary teams and third-party suppliers to drive key aspects of test definition, execution, and optimization.

You will own digital ATE test development end-to-end on Advantest 93K and/or Teradyne UltraFLEX platforms, from bring-up and pattern conversion through characterization, correlation, and production release. You will develop and debug structural and functional test content including scan/ATPG, MBIST and memory repair, and other DFT-based tests, as well as high-speed SERDES/HSIO test for complex modem and/or ASIC/SoC devices. You must be responsive, flexible, and able to succeed within an open, collaborative peer environment, and you will influence ASIC design, DFT, and manufacturing teams to ensure our products are architected for testability and cost-effective high-volume manufacturing.

Export Control Requirement

Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Key job responsibilities

In this role you will:

  • Develop, debug, and release digital test programs for complex ASIC/SoC and modem devices on Advantest 93K and/or Teradyne UltraFLEX platforms.
  • Build and debug scan/ATPG test content (stuck-at, transition, and other fault models) for complex ASIC/SoC and modem devices.
  • Implement MBIST and memory repair flows.
  • Characterize silicon performance and process variation through ring oscillator and process monitor tests.
  • Test and debug I/O interface such as I3C, SPI, and GPIO.
  • Optimize high-speed SERDES/HSIO test, including equalization, jitter/eye characterization, BER, and loopback.
  • Convert test patterns from the DFT team into tester-suitable formats (e.g., STIL/WGL to native tester formats) and validate them on hardware.
  • Bring up and characterize new devices, define test conditions (timing and levels), and drive shmoo/characterization to establish robust production limits and guard bands.
  • Lead device correlation between wafer sort and final test, resolving systematic offsets and measurement issues.
  • Reduce test time and cost across digital and DC test content while maintaining test coverage and quality.
  • Design and review final test (FT) and wafer sort (WT) hardware, including load board, socket, and probe card designs, for best layout practices and signal/power integrity, particularly for high-speed digital interfaces.
  • Partner with ASIC design and DFT teams to ensure devices meet Amazon standards for design-for-test and design-for-manufacturability in advanced process nodes.
  • Analyze production data using statistical methods (Cp/Cpk, yield analysis) to drive continuous improvement in yield, quality, and test efficiency.
  • Actively identify test-related readiness gaps, issues, and optimization opportunities throughout the product lifecycle and drive them to resolution.
  • Support qualification activities such as burn-in board design, HTOL, and ESD.
  • Mentor and provide technical guidance to junior test engineers, lead technical reviews, and set best practices for the test development team.
Basic Qualifications
  • Bachelor's degree or above in electrical engineering, computer engineering, or equivalent
  • 7+ years of experience in digital ATE test development and test engineering, preferably in high-volume manufacturing.
  • Experience testing complex SoCs and modem/wireless communication devices in advanced nodes (7nm and below).
  • Experience developing and debugging test programs on Advantest 93K and/or Teradyne UltraFLEX platforms.
  • Familiarity with JTAG and boundary-scan techniques, and with DFT/DFM principles.
  • Experience with digital test methodologies such as scan/ATPG, MBIST, Vmin search, and loopback.
  • Proficiency in advanced high-speed SERDES test at 100G+, including equalization tuning and jitter decomposition.
  • Experience with wafer sort and final test ATE hardware development, bring-up, and debugging.
  • Strong written and verbal communication skills.
  • International travel required during release-to-production phases.
Preferred Qualifications
  • Master's degree in Electrical/Computer Engineering.
  • Demonstrated ability to lead cross-functional technical efforts and mentor other engineers.
  • Experience running firmware on DUTs to reduce test time and increase self-testability.
  • Working knowledge of PLL test and characterization (lock time, jitter, loop bandwidth).
  • Understanding of standard silicon security concerns for these device types, such as secure boot, secure key/identity provisioning, and protection of sensitive assets during manufacturing and test.
  • Experience with OTP/eFuse programming and qualification.
  • Strong data analysis skills using statistical platforms (JMP, or similar), yield and process capability metrics, data interpretation, and bench/tester correlation
  • Knowledge of PCB design requirements and layout best practices for high-speed signaling.
  • Understanding of semiconductor manufacturing, assembly, and test processes in advanced nodes.
  • Familiarity with production control processes.
  • Working knowledge of scripting languages such as Python, Perl, and Tcl/Tk.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits .

USA, CA, San Diego - 185,200.00 - 250,000.00 USD annually

USA, CA, Sunnyvale - 213,000.00 - 287,500.00 USD annually

USA, WA, Redmond - 185,200.00 - 250,000.00 USD annually

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